EP4CGX50DF27C7N

The EP4CGX50DF27C7N is a Cyclone® IV GX field programmable gate array (FPGA) supplied in a 672-ball BGA package. It provides a balance of logic capacity, embedded memory, and I/O density for commercial embedded designs.

With 49,888 logic elements, approximately 2.56 Mbits of on-chip RAM, and up to 310 I/O, this device targets applications that require significant logic integration and plentiful external interfacing while operating within a commercial temperature range.

Key Features

• Core Logic — 49,888 logic elements to implement complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 2.56 Mbits of on-chip RAM for data buffering, state storage, and local working memory.
• I/O Density — Up to 310 I/O pins to support multiple external interfaces, sensors, and peripherals.
• Package — 672-ball BGA (supplier package: 672-FBGA (27×27)) surface-mount package for high-density board integration.
• Power — Core supply voltage range of 1.16 V to 1.24 V to match system-level power architectures.
• Thermal and Grade — Commercial-grade device specified for operation from 0 °C to 85 °C.
• RoHS Compliance — Environmentally compliant for regulated applications.

Typical Applications

• High-density digital processing — Implement custom datapaths, protocol processing, and hardware acceleration using nearly 50k logic elements.
• I/O-heavy control systems — Leverage up to 310 I/O pins for interface-rich designs such as multi-channel acquisition or mixed-signal control.
• Embedded memory applications — Use approximately 2.56 Mbits of on-chip RAM for buffering, FIFOs, and state machines in embedded designs.

Unique Advantages

• Substantial logic capacity: 49,888 logic elements enable integration of multiple functions on a single device, reducing BOM and board complexity.
• Generous embedded memory: Approximately 2.56 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• I/O flexibility: Up to 310 I/O pins support a wide range of peripherals and interfaces without additional I/O expanders.
• Compact BGA packaging: The 672-ball FBGA package supports high-density board layouts for space-constrained designs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• Regulatory compliance: RoHS-compliant construction supports environmentally conscious product designs.

Why Choose EP4CGX50DF27C7N?

The EP4CGX50DF27C7N delivers a compelling combination of logic capacity, embedded memory, and I/O density in a compact 672-ball BGA package for commercial embedded applications. Its specification set is suited for designers who need substantial on-chip resources and flexible interfacing within a standard commercial operating range.

This device is appropriate for teams seeking to consolidate multiple system functions onto a single FPGA, reduce external component count, and leverage on-chip RAM for latency-sensitive tasks while maintaining RoHS compliance and a defined supply voltage range.

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