EP4CGX50DF27I7N

The EP4CGX50DF27I7N is a Cyclone® IV GX field programmable gate array (FPGA) IC from Intel. It integrates 49,888 logic elements, approximately 2.56 Mbits of embedded memory, and 310 I/O in a 672-BGA package.

Designed as an industrial-grade, surface-mount FPGA, the device operates from 1.16 V to 1.24 V and supports an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant and supplied in a 672-FBGA (27 × 27 mm) package.

Key Features

• Core Logic  49,888 logic elements provide programmable capacity for custom digital designs.
• Embedded Memory  Approximately 2.56 Mbits (2,562,048 bits) of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Capacity  310 I/O pins to support multiple interfaces and board-level connectivity requirements.
• Package & Mounting  672-BGA package, supplier device package 672-FBGA (27 × 27 mm), designed for surface-mount assembly.
• Power  Core supply range of 1.16 V to 1.24 V for power-rail planning and regulator selection.
• Temperature & Grade  Industrial grade device supporting operation from −40 °C to 100 °C for demanding environments.
• Environmental Compliance  RoHS compliant to meet regulated material requirements.

Typical Applications

• Industrial control systems  Use the industrial temperature rating and programmable logic capacity for reliable control and automation functions.
• High-density I/O interfaces  Leverage 310 I/O pins to implement board-level bridging, protocol conversion, and multi-channel I/O aggregation.
• Embedded memory buffering  Approximately 2.56 Mbits of on-chip RAM supports data buffering, packet staging, and local storage for latency-critical tasks.
• Custom digital IP integration  The large logic element count enables integration of custom processing blocks, state machines, and peripheral controllers on a single device.

Unique Advantages

• High programmable capacity: 49,888 logic elements enable complex and scalable custom logic implementations without immediate redesign.
• Substantial on-chip memory: Approximately 2.56 Mbits of RAM reduces dependence on external memory for many buffering and state-holding tasks.
• Ample I/O: 310 I/O pins provide flexibility to connect multiple peripherals and high-pin-count interfaces directly to the FPGA.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact, manufacturable package: 672-FBGA (27 × 27 mm) BGA package supports high-density PCB layouts and surface-mount assembly.
• Controlled supply range: Narrow 1.16–1.24 V supply range simplifies power-rail design and regulator selection.

Why Choose EP4CGX50DF27I7N?

The EP4CGX50DF27I7N delivers a combination of substantial programmable logic, embedded memory, and a high I/O count in a compact 672-BGA package. Its industrial temperature rating and RoHS compliance make it suitable for engineered systems that require reliable operation across a wide temperature range.

This Intel Cyclone® IV GX FPGA is well suited for engineers and designers who need a balanced mix of logic density, on-chip RAM, and I/O capacity for industrial and embedded applications. Its package and supply voltage characteristics support predictable integration into board-level designs.

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