EP4CGX75CF23C6N

The EP4CGX75CF23C6N is an Intel Cyclone® IV GX field programmable gate array (FPGA) in a 484-ball BGA package. It provides a high logic capacity and embedded memory resources in a commercial-grade device intended for programmable digital designs.

This device offers a combination of 73,920 logic elements, approximately 4.26 Mbits of on-chip embedded memory, and 290 general-purpose I/O pins, all within a 484-FBGA (23×23) surface-mount package. The device operates from a core supply range of 1.16 V to 1.24 V and supports an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  73,920 logic elements to implement complex programmable logic and custom digital architectures.
• Embedded Memory  Approximately 4.26 Mbits of on-chip RAM for buffering, lookup tables, and state storage within designs.
• Flexible I/O  290 I/O pins support a wide range of external interfaces and parallel/serial connectivity requirements.
• Package and Mounting  484-FBGA (23×23) surface-mount package (484-BGA package case) for high-density board integration.
• Power  Core voltage supply range of 1.16 V to 1.24 V to match system power architectures and ensure stable operation.
• Commercial Temperature Range  Rated for operation from 0 °C to 85 °C for commercial-environment applications.
• RoHS Compliant  Environmentally compliant manufacturing suitable for RoHS-directed designs.

Typical Applications

• Custom digital logic and prototyping  Implement and iterate complex state machines, data paths, and custom accelerators using the device's high logic element count.
• High-density I/O interfacing  Use the 290 I/O pins for multiplexed sensor interfaces, parallel bus bridging, or board-level glue logic.
• On-chip buffering and data handling  Leverage the approximately 4.26 Mbits of embedded memory for packet buffering, FIFOs, and lookup storage within communication or signal-processing pipelines.

Unique Advantages

• High logic integration: 73,920 logic elements enable consolidation of multiple functions into a single FPGA, reducing bill-of-materials and board complexity.
• Significant on-chip memory: Approximately 4.26 Mbits of embedded RAM supports on-chip data storage and reduces external memory dependence.
• Broad I/O count: 290 I/O pins provide flexibility for diverse interfacing needs without external multiplexers.
• Compact surface-mount package: 484-FBGA (23×23) packaging delivers a high-density footprint for space-constrained PCB designs.
• Commercial operating range: Rated 0 °C to 85 °C to align with standard commercial product environments.
• RoHS compliance: Meets RoHS requirements for environmentally conscious manufacturing and supply chains.

Why Choose EP4CGX75CF23C6N?

The EP4CGX75CF23C6N positions itself as a high-capacity, commercially rated FPGA option for designers who need substantial logic density, embedded memory, and a large I/O complement in a compact 484-FBGA package. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of standard electronic products and development projects.

For teams focused on consolidating multiple functions onto a single programmable device, minimizing external memory needs, and integrating dense I/O, this Cyclone IV GX device provides a balanced combination of resources, package density, and RoHS compliance.

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