EP4CGX75CF23C7N

The EP4CGX75CF23C7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, designed for mid-range programmable logic applications. It delivers substantial on-chip resources—73,920 logic elements and approximately 4.26 Mbits of embedded memory—combined with 290 user I/O pins for flexible system integration.

Packaged in a 484-FBGA (23×23) surface-mount case and specified for commercial use, this device operates from a 1.16 V to 1.24 V supply and across a 0 °C to 85 °C temperature range, making it suitable for a wide range of standard embedded designs.

Key Features

• Silicon Architecture  Field Programmable Gate Array architecture providing 73,920 logic elements to implement custom digital logic and control functions.
• Embedded Memory  Approximately 4.26 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
• High I/O Count  290 I/O pins for broad connectivity and interface options within a single device package.
• Power Supply Range  Operates from a core voltage range of 1.16 V to 1.24 V to match system power architectures.
• Package & Mounting  484-FBGA (23×23) package case in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Custom Digital Logic  Implement application-specific processing, state machines, and control logic using the available 73,920 logic elements.
• Interface Integration  Use the 290 I/O pins to consolidate multiple interfaces and glue-logic functions onto a single FPGA.
• On-chip Data Handling  Leverage approximately 4.26 Mbits of embedded memory for buffering, packet handling, and local storage tasks.

Unique Advantages

• Substantial Logic Density: 73,920 logic elements provide the capacity to implement complex digital designs without immediate migration to larger devices.
• Significant Embedded Memory: Approximately 4.26 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• High Pin Count: 290 I/O pins enable extensive peripheral and interface support from a single package.
• Compact Surface-Mount Package: 484-FBGA (23×23) supports high-density board layouts while maintaining manufacturability.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with a wide range of standard embedded applications.
• RoHS Compliant: Meets lead-free and hazardous-substance requirements for environmentally conscious designs.

Why Choose EP4CGX75CF23C7N?

The EP4CGX75CF23C7N delivers a balance of logic capacity, embedded memory, and I/O resources in a compact 484-FBGA surface-mount package. Its specification set—73,920 logic elements, approximately 4.26 Mbits of on-chip RAM, 290 I/Os, and a commercial temperature rating—makes it well suited for designers seeking a mid-range Cyclone IV GX FPGA for system integration and custom logic implementations.

Manufactured by Intel and provided in a RoHS-compliant form factor, this device is a practical choice for teams building scalable, board-level digital systems that require predictable operating voltage and temperature characteristics.

Request a quote or submit an RFQ to obtain pricing and availability for EP4CGX75CF23C7N and to discuss how this Cyclone® IV GX FPGA can meet your design requirements.