EP4CGX75CF23C8N

The EP4CGX75CF23C8N is a Cyclone® IV GX Field Programmable Gate Array from Intel, delivered in a 484-ball BGA package for surface-mount board integration. It combines mid-density programmable logic with substantial on-chip RAM and a high I/O count to support a wide range of commercial designs.

With 73,920 logic elements, approximately 4.26 Mbits of embedded memory and up to 290 user I/Os, this device is well suited to commercial applications that require configurable logic, moderate embedded storage, and flexible I/O connectivity within a 0 °C to 85 °C operating window.

Key Features

• Logic Capacity — 73,920 logic elements providing substantial programmable logic resources for mid-density designs; organized across 4,620 logic blocks for fine-grained implementation.
• Embedded Memory — Approximately 4.26 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• I/O Density — Up to 290 user I/Os to enable broad peripheral interfacing and board-level connectivity.
• Package & Mounting — 484-BGA package (supplier device package: 484-FBGA, 23 × 23) designed for surface-mount assembly and compact, reliable board integration.
• Power — Core operating supply range of 1.16 V to 1.24 V to match system power-rail planning.
• Temperature & Grade — Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• Embedded Systems — Use the programmable logic and ~4.26 Mbits of embedded memory to implement custom hardware acceleration, protocol handling, or peripheral glue logic in commercial embedded products.
• Board-Level I/O Control — Leverage up to 290 user I/Os for high-density interfacing with sensors, connectors, and daughtercards in complex board designs.
• Prototyping and Development — Suitable for evaluating and validating mid-density FPGA architectures and custom logic functions in commercial-temperature prototype systems.
• Integration-Focused Designs — The 484-FBGA (23×23) surface-mount package supports compact, manufacturable designs where board space and reliable solder joints are important.

Unique Advantages

• Balanced Logic and Memory: 73,920 logic elements paired with approximately 4.26 Mbits of embedded RAM provide a versatile resource mix for both control logic and data buffering.
• High I/O Count: 290 user I/Os offer flexibility for complex interfacing and multiple peripheral connections without immediate need for external I/O expanders.
• Compact, Manufacturable Package: 484-FBGA (23×23) surface-mount package simplifies board layout and supports automated assembly processes.
• Commercial Temperature Support: Rated for 0 °C to 85 °C operation to match a wide range of commercial applications and deployments.
• Vendor Backing: Manufactured by Intel, providing access to manufacturer documentation and product support resources.
• Regulatory Compliance: RoHS compliant to aid in meeting environmental and sourcing requirements.

Why Choose EP4CGX75CF23C8N?

The EP4CGX75CF23C8N positions itself as a capable mid-density FPGA option that balances sizable programmable logic, embedded memory, and a high I/O count within a compact 484-BGA surface-mount package. Its commercial temperature rating and RoHS compliance make it appropriate for a broad set of commercial electronic designs where board-level integration and configurable logic are required.

This device is a practical choice for engineering teams and procurement organizations seeking a field-programmable solution backed by Intel's manufacturing and documentation. Its resource mix supports scalable designs that can evolve through iterative development while maintaining compact board-level form factors.

If you would like pricing, availability, or to request a formal quote for EP4CGX75CF23C8N, please submit a procurement inquiry and our team will respond with the next steps.