EP4CGX75DF27C6

The EP4CGX75DF27C6 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 672‑BGA package. It provides a combination of programmable logic, on‑chip memory, and a substantial I/O count for a wide range of commercial embedded designs.

This device includes 73,920 logic elements, approximately 4.26 Mbits of embedded memory, and 310 user I/O pins, operating from a supply range of 1.16 V to 1.24 V and across a commercial temperature range of 0 °C to 85 °C. The package is a 672‑FBGA (27×27) surface‑mount part and is RoHS compliant.

Key Features

• FPGA Core 73,920 logic elements provide the programmable fabric for custom digital functions and parallel processing architectures.
• Embedded Memory Approximately 4.26 Mbits of on‑chip RAM to support buffers, FIFOs, and local data storage without external memory in many designs.
• I/O Capacity 310 user I/O pins enable high‑density external device interfacing and wide parallel connectivity.
• Power Nominal device supply voltage range of 1.16 V to 1.24 V for core power planning and system power budgeting.
• Package & Mounting 672‑BGA (672‑FBGA, 27×27) surface‑mount package for compact board integration and consistent solder profile.
• Temperature & Compliance Commercial operating range of 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.

Typical Applications

• Embedded Systems Implement custom data paths, protocol handling, or control logic where 73,920 logic elements and embedded RAM accelerate system tasks.
• Communications & Networking Use the device's logic capacity and 310 I/Os to implement packet processing, interface bridging, or protocol conversion functions.
• Prototyping and Development Leverage the programmable fabric and substantial on‑chip memory to validate algorithms and iterate hardware designs.
• High‑Density I/O Systems Integrate multiple peripherals and parallel interfaces using the large user I/O count in a compact 672‑BGA footprint.

Unique Advantages

• High Logic Capacity: 73,920 logic elements enable complex custom logic and parallel implementations within a single device.
• On‑Chip Memory: Approximately 4.26 Mbits of embedded RAM reduce dependency on external memory for many buffer and storage needs.
• Large I/O Count: 310 user I/Os support extensive external connectivity, simplifying board design for multi‑interface applications.
• Compact Packaging: The 672‑FBGA (27×27) surface‑mount package offers a high‑density solution for space‑constrained PCBs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match a wide set of commercial product environments.
• RoHS Compliant: Conforms to RoHS environmental requirements for lead‑free manufacturing processes.

Why Choose EP4CGX75DF27C6?

The EP4CGX75DF27C6 positions itself as a commercial‑grade Cyclone® IV GX FPGA that balances substantial logic density, meaningful embedded memory, and a high I/O count in a compact 672‑BGA package. It is suited for customers building mid‑ to high‑complexity designs that require on‑device resources for processing, buffering, and interfacing while operating within a 0 °C to 85 °C range.

Manufactured by Intel, this device aligns with projects that prioritize integration and predictable commercial‑grade operating conditions, offering a clear specification set for design, power budgeting, and PCB layout.

Request a quote or submit an inquiry for pricing and availability of EP4CGX75DF27C6 to move your design forward.