EP4CGX75DF27C7

The EP4CGX75DF27C7 is an Intel Cyclone® IV GX field programmable gate array supplied in a 672‑ball BGA package. It delivers 73,920 logic elements, approximately 4.26 Mbits of embedded memory, and 310 user I/O pins for commercial embedded designs requiring significant programmable logic and on‑chip RAM resources.

Packaged for surface‑mount applications and specified for commercial temperature operation, this device supports designs with a core supply range of 1.16 V to 1.24 V and RoHS compliance for regulatory alignment.

Key Features

• Core Logic — 73,920 logic elements to implement complex programmable logic functions.
• Embedded Memory — Approximately 4.26 Mbits of on‑chip RAM (4,257,792 total RAM bits) for data buffering, FIFOs, and state storage.
• I/O Capability — 310 user I/O pins to support multiple external interfaces and dense board-level connectivity.
• Power — Core voltage supply specified from 1.16 V to 1.24 V for predictable power budgeting and design planning.
• Package and Mounting — 672‑FBGA (27×27) package, surface mount, package case 672‑BGA for high‑density PCB layouts.
• Temperature Rating — Commercial grade operation from 0 °C to 85 °C suitable for standard commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the device’s large logic capacity and embedded RAM to implement custom processing, control logic, and glue‑logic functions in commercial products.
• High‑Density I/O Platforms — Leverage 310 I/O pins for multi‑channel interfaces, sensor arrays, or board‑level interconnect requirements.
• Data Buffering and Packet Processing — Embedded memory supports buffering, FIFOs, and temporary storage needed in communication and data handling tasks.

Unique Advantages

• Substantial Logic Resources: 73,920 logic elements allow implementation of sizable custom logic blocks within a single device, reducing the need for multiple discrete ICs.
• Integrated Memory: Approximately 4.26 Mbits of on‑chip RAM minimizes external memory dependencies for many buffering and state‑storage requirements.
• High I/O Count: 310 user I/Os enable flexible interfacing to peripherals, sensors, and high‑pin count connectors without extensive PCB routing complexity.
• Compact, Surface‑Mount Package: 672‑FBGA (27×27) provides a high pin‑count solution in a compact footprint for board‑space constrained designs.
• Commercial Temperature Grade: Rated 0 °C to 85 °C to match typical commercial deployment environments and product lifecycles.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs and supply chain compliance.

Why Choose EP4CGX75DF27C7?

The EP4CGX75DF27C7 combines a substantial logic element count with several megabits of embedded RAM and a high I/O count in a compact 672‑FBGA package, making it well suited for commercial designs that require integrated programmable logic and on‑chip memory. Its supply voltage specification and commercial temperature rating provide clear electrical and environmental boundaries for system design.

This device is appropriate for teams and projects that need a single‑chip programmable solution to consolidate logic, reduce component count, and simplify board layout while maintaining RoHS compliance and predictable supply requirements.

Request a quote or submit an inquiry to get pricing and availability for the EP4CGX75DF27C7 for your next commercial FPGA design.