EP4CGX75DF27C8N

The EP4CGX75DF27C8N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) in a 672-BGA package designed for commercial embedded applications. It integrates a large complement of logic elements and on-chip RAM to support complex, custom digital designs that require high I/O density and moderate embedded memory.

Key Features

• Programmable Logic  Contains 73,920 logic elements to implement a wide range of custom digital functions and control logic.
• Embedded Memory  Approximately 4.26 Mbits of embedded memory (4,257,792 bits) for buffering, lookup tables, and on-chip data storage.
• I/O Capacity  310 user I/O pins provide flexible external interface options for sensors, peripherals, and system buses.
• Power  Operates from a core supply range of 1.16 V to 1.24 V to match system power-rail designs and ensure stable core performance.
• Package & Mounting  Supplied in a 672-BGA (672-FBGA, 27×27) package suitable for surface-mount PCB assembly with high pin density per area.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• Custom Digital Processing  Use the device’s 73,920 logic elements and on-chip RAM to implement custom datapaths, protocol offloads, and control engines.
• High-Density I/O Interfaces  Leverage 310 I/O pins for board-level interfacing to multiple peripherals, sensors, and external memory devices.
• Embedded Systems and Prototyping  Surface-mount 672-BGA packaging and commercial temperature grading make this FPGA suitable for embedded proof-of-concept and production designs within the specified temperature range.

Unique Advantages

• High Logic Capacity: 73,920 logic elements enable consolidation of multiple functions into a single device, reducing BOM count and board complexity.
• Substantial On-Chip Memory: Approximately 4.26 Mbits of embedded RAM support local buffering and state storage without immediate dependence on external memory.
• Ample I/O Resources: 310 I/O pins provide flexibility for complex interfacing and board-level integration across many signals and protocols.
• Compact, High-Density Package: 672-FBGA (27×27) offers high pin count in a compact footprint, aiding space-constrained PCB designs.
• Design-Ready Power Range: Narrow core voltage range (1.16 V–1.24 V) simplifies core power supply design and voltage sequencing planning.
• RoHS Compliant: Meets environmental manufacturing requirements for lead-free production processes.

Why Choose EP4CGX75DF27C8N?

This Cyclone® IV GX FPGA balances a large logic fabric with significant embedded memory and extensive I/O to address mid-to-high complexity digital designs within commercial temperature ranges. It is positioned for engineers who need high integration density, on-chip storage, and a high pin-count package for compact system implementations.

With its combination of 73,920 logic elements, approximately 4.26 Mbits of embedded RAM, and 310 I/O, the EP4CGX75DF27C8N delivers a scalable platform for consolidating functions, reducing external components, and shortening development cycles while remaining compliant with RoHS requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4CGX75DF27C8N.