EP4CGX75DF27C6N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 4257792 73920 672-BGA |
|---|---|
| Quantity | 858 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 310 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4620 | Number of Logic Elements/Cells | 73920 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4257792 |
Overview of EP4CGX75DF27C6N – Cyclone® IV GX FPGA, 73,920 Logic Elements, 672-BGA
The EP4CGX75DF27C6N is an Intel Cyclone® IV GX Field Programmable Gate Array (FPGA) IC. It provides a high-capacity programmable-logic solution with 73,920 logic elements and approximately 4.26 Mbits of embedded memory.
Key device attributes include 310 I/O pins, a 672-ball BGA package (672-FBGA, 27×27), surface-mount mounting, a nominal supply voltage range of 1.16 V to 1.24 V, commercial-grade operating temperature from 0 °C to 85 °C, and RoHS compliance.
Key Features
- Core and Architecture Cyclone® IV GX family FPGA offering a programmable logic fabric for custom digital implementations.
- Logic Resources 73,920 logic elements available for complex combinational and sequential logic designs.
- Embedded Memory Approximately 4.26 Mbits of on-chip RAM to support buffering, LUT-based memory, and local data storage.
- I/O Capacity 310 I/O pins to interface with external devices and peripherals.
- Power Designed for operation with a core supply voltage between 1.16 V and 1.24 V.
- Package and Mounting 672-ball BGA package (672-FBGA, 27×27) in a surface-mount format for compact board integration.
- Operating Range Commercial-grade device rated for 0 °C to 85 °C ambient operation.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 73,920 logic elements provide substantial programmable resources for large-scale designs.
- Integrated on-chip memory: Approximately 4.26 Mbits of embedded RAM reduces the need for external memory in many designs.
- Generous I/O count: 310 I/Os enable extensive interfacing options with sensors, peripherals, and system buses.
- Compact BGA package: 672-FBGA (27×27) enables a dense board layout while accommodating high routing density.
- Commercial operating range: Rated 0 °C to 85 °C to match standard commercial application requirements.
- RoHS compliant: Meets environmental compliance needs for assembly and distribution.
Why Choose EP4CGX75DF27C6N?
The EP4CGX75DF27C6N combines a large logic element count, substantial embedded memory, and a high I/O count in a compact 672-BGA surface-mount package, making it suitable for designs that require significant on-chip programmable resources within a commercial-temperature envelope. Its defined supply voltage range and RoHS compliance support consistent integration into commercial electronic products.
Choose this Cyclone® IV GX FPGA when your design demands a high-capacity, board-friendly programmable logic device with clear, verifiable specifications for logic, memory, I/O, power, and operating temperature.
Request a quote or submit an inquiry to receive pricing and availability information for EP4CGX75DF27C6N.

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