EP4CGX75DF27C6N

IC FPGA 310 I/O 672FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 4257792 73920 672-BGA

Quantity 858 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O310Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4620Number of Logic Elements/Cells73920
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4257792

Overview of EP4CGX75DF27C6N – Cyclone® IV GX FPGA, 73,920 Logic Elements, 672-BGA

The EP4CGX75DF27C6N is an Intel Cyclone® IV GX Field Programmable Gate Array (FPGA) IC. It provides a high-capacity programmable-logic solution with 73,920 logic elements and approximately 4.26 Mbits of embedded memory.

Key device attributes include 310 I/O pins, a 672-ball BGA package (672-FBGA, 27×27), surface-mount mounting, a nominal supply voltage range of 1.16 V to 1.24 V, commercial-grade operating temperature from 0 °C to 85 °C, and RoHS compliance.

Key Features

  • Core and Architecture  Cyclone® IV GX family FPGA offering a programmable logic fabric for custom digital implementations.
  • Logic Resources  73,920 logic elements available for complex combinational and sequential logic designs.
  • Embedded Memory  Approximately 4.26 Mbits of on-chip RAM to support buffering, LUT-based memory, and local data storage.
  • I/O Capacity  310 I/O pins to interface with external devices and peripherals.
  • Power  Designed for operation with a core supply voltage between 1.16 V and 1.24 V.
  • Package and Mounting  672-ball BGA package (672-FBGA, 27×27) in a surface-mount format for compact board integration.
  • Operating Range  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: 73,920 logic elements provide substantial programmable resources for large-scale designs.
  • Integrated on-chip memory: Approximately 4.26 Mbits of embedded RAM reduces the need for external memory in many designs.
  • Generous I/O count: 310 I/Os enable extensive interfacing options with sensors, peripherals, and system buses.
  • Compact BGA package: 672-FBGA (27×27) enables a dense board layout while accommodating high routing density.
  • Commercial operating range: Rated 0 °C to 85 °C to match standard commercial application requirements.
  • RoHS compliant: Meets environmental compliance needs for assembly and distribution.

Why Choose EP4CGX75DF27C6N?

The EP4CGX75DF27C6N combines a large logic element count, substantial embedded memory, and a high I/O count in a compact 672-BGA surface-mount package, making it suitable for designs that require significant on-chip programmable resources within a commercial-temperature envelope. Its defined supply voltage range and RoHS compliance support consistent integration into commercial electronic products.

Choose this Cyclone® IV GX FPGA when your design demands a high-capacity, board-friendly programmable logic device with clear, verifiable specifications for logic, memory, I/O, power, and operating temperature.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CGX75DF27C6N.

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