EP4CGX75CF23C7
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 4257792 73920 484-BGA |
|---|---|
| Quantity | 560 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 290 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4620 | Number of Logic Elements/Cells | 73920 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4257792 |
Overview of EP4CGX75CF23C7 – Cyclone® IV GX FPGA, 73,920 Logic Elements, 484‑BGA
The EP4CGX75CF23C7 is a Cyclone® IV GX field programmable gate array supplied in a 484‑BGA package for surface‑mount assembly. It provides a high logic capacity and embedded memory suitable for commercial embedded and system‑level designs that require flexible programmable logic and on‑chip RAM.
Key architectural attributes include 73,920 logic elements, approximately 4.26 Mbits of embedded memory, and up to 290 I/O pins, enabling dense logic implementation and a broad set of external interfaces within a compact 23 × 23 FBGA footprint.
Key Features
- Logic Capacity 73,920 logic elements for implementing complex digital logic functions and custom processing pipelines.
- Embedded Memory Approximately 4.26 Mbits of on‑chip RAM (4,257,792 total RAM bits) to support buffering, LUT‑based storage, and data‑path requirements.
- I/O Density Up to 290 I/O pins to accommodate multiple peripherals, parallel interfaces, and board‑level connectivity.
- Power Supply Operating core voltage range of 1.16 V to 1.24 V to match system power rails and design requirements.
- Package & Mounting 484‑BGA (484‑FBGA, 23 × 23) surface‑mount package for compact PCB integration and high pin count routing.
- Operating Range Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
- Regulatory RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.
Unique Advantages
- High logic density: 73,920 logic elements let you consolidate complex functions into a single FPGA, reducing BOM and board space.
- Substantial on‑chip memory: Approximately 4.26 Mbits of embedded RAM supports data buffering and local storage without external memory.
- Flexible I/O count: 290 I/O pins provide versatility for interfacing multiple sensors, peripherals, and high‑pin‑count connectors.
- Compact, manufacturable package: 484‑BGA (23 × 23) surface‑mount package supports dense PCB layouts and automated assembly processes.
- Commercial operating profile: Designed for standard commercial temperature ranges and systems where RoHS compliance is required.
Why Choose EP4CGX75CF23C7?
The EP4CGX75CF23C7 positions itself as a high‑capacity Cyclone® IV GX FPGA option for commercial applications that need significant programmable logic and on‑chip memory within a compact BGA package. Its combination of 73,920 logic elements, roughly 4.26 Mbits of embedded RAM, and 290 I/O pins provides designers with the resources to implement complex logic, buffering, and multi‑interface connectivity on a single device.
This device is suited to teams and projects focused on scalable, integrated FPGA solutions that prioritize logic density, embedded memory, and a compact footprint, while aligning with RoHS requirements and standard commercial operating temperatures.
Request a quote or submit a sales inquiry to evaluate EP4CGX75CF23C7 for your next design.

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