EP4CGX75CF23C7

IC FPGA 290 I/O 484FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 4257792 73920 484-BGA

Quantity 560 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O290Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4620Number of Logic Elements/Cells73920
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4257792

Overview of EP4CGX75CF23C7 – Cyclone® IV GX FPGA, 73,920 Logic Elements, 484‑BGA

The EP4CGX75CF23C7 is a Cyclone® IV GX field programmable gate array supplied in a 484‑BGA package for surface‑mount assembly. It provides a high logic capacity and embedded memory suitable for commercial embedded and system‑level designs that require flexible programmable logic and on‑chip RAM.

Key architectural attributes include 73,920 logic elements, approximately 4.26 Mbits of embedded memory, and up to 290 I/O pins, enabling dense logic implementation and a broad set of external interfaces within a compact 23 × 23 FBGA footprint.

Key Features

  • Logic Capacity  73,920 logic elements for implementing complex digital logic functions and custom processing pipelines.
  • Embedded Memory  Approximately 4.26 Mbits of on‑chip RAM (4,257,792 total RAM bits) to support buffering, LUT‑based storage, and data‑path requirements.
  • I/O Density  Up to 290 I/O pins to accommodate multiple peripherals, parallel interfaces, and board‑level connectivity.
  • Power Supply  Operating core voltage range of 1.16 V to 1.24 V to match system power rails and design requirements.
  • Package & Mounting  484‑BGA (484‑FBGA, 23 × 23) surface‑mount package for compact PCB integration and high pin count routing.
  • Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Regulatory  RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Unique Advantages

  • High logic density: 73,920 logic elements let you consolidate complex functions into a single FPGA, reducing BOM and board space.
  • Substantial on‑chip memory: Approximately 4.26 Mbits of embedded RAM supports data buffering and local storage without external memory.
  • Flexible I/O count: 290 I/O pins provide versatility for interfacing multiple sensors, peripherals, and high‑pin‑count connectors.
  • Compact, manufacturable package: 484‑BGA (23 × 23) surface‑mount package supports dense PCB layouts and automated assembly processes.
  • Commercial operating profile: Designed for standard commercial temperature ranges and systems where RoHS compliance is required.

Why Choose EP4CGX75CF23C7?

The EP4CGX75CF23C7 positions itself as a high‑capacity Cyclone® IV GX FPGA option for commercial applications that need significant programmable logic and on‑chip memory within a compact BGA package. Its combination of 73,920 logic elements, roughly 4.26 Mbits of embedded RAM, and 290 I/O pins provides designers with the resources to implement complex logic, buffering, and multi‑interface connectivity on a single device.

This device is suited to teams and projects focused on scalable, integrated FPGA solutions that prioritize logic density, embedded memory, and a compact footprint, while aligning with RoHS requirements and standard commercial operating temperatures.

Request a quote or submit a sales inquiry to evaluate EP4CGX75CF23C7 for your next design.

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