EP4CGX50DF27I7

The EP4CGX50DF27I7 is a Cyclone® IV GX field programmable gate array (FPGA) in a 672-ball BGA package from Intel. It integrates 49,888 logic elements, approximately 2.56 Mbits of on-chip RAM, and up to 310 I/O pins to support dense digital implementations and complex interfacing requirements.

Designed for applications that require significant logic capacity, embedded memory, and extensive I/O while operating across industrial temperature ranges, this surface-mount FPGA provides a compact package and industry-focused operating characteristics for robust system integration.

Key Features

• Logic Capacity — 49,888 logic elements to implement complex digital logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 2.56 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Count — 310 I/O pins to support wide peripheral interfacing, parallel buses, and multi-channel I/O requirements.
• Package and Mounting — 672-BGA (672-FBGA, 27 × 27 mm) in a surface-mount package for dense PCB integration and reliable solder attach.
• Power — Core voltage supply range of 1.16 V to 1.24 V to match board power-rail designs and power sequencing requirements.
• Industrial Temperature Range — Rated operation from −40 °C to 100 °C to support industrial-class deployments.
• Regulatory — RoHS compliant for environmentally conscious manufacturing and compliance programs.

Typical Applications

• High-density digital systems — Implement large-scale logic functions and custom accelerators using 49,888 logic elements.
• Memory-buffering and data paths — Use approximately 2.56 Mbits of embedded RAM for packet buffering, FIFOs, and latency management.
• I/O-intensive interfaces — Support multi-channel sensor, protocol bridging, or parallel bus designs with 310 available I/Os.
• Industrial control equipment — Deploy in environments within the −40 °C to 100 °C operating range for reliable industrial operation.

Unique Advantages

• High logic density: 49,888 logic elements provide the capacity to consolidate multiple functions into a single device, reducing component count.
• On-chip memory for buffering: Approximately 2.56 Mbits of RAM enables local data storage and efficient dataflow without external memory in some designs.
• Extensive I/O: 310 I/Os give designers flexibility for parallel interfaces, numerous peripherals, and mixed-signal front-ends.
• Compact BGA package: 672-BGA (27 × 27 mm) allows for a high-pin-count solution in a space-efficient surface-mount form factor.
• Industrial temperature support: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• RoHS compliant: Conforms to environmental compliance requirements for modern manufacturing processes.

Why Choose EP4CGX50DF27I7?

The EP4CGX50DF27I7 combines substantial logic resources, meaningful on-chip RAM capacity, and a wide I/O complement in a compact 672-BGA package, making it suitable for designs that need integrated digital logic, buffering, and flexible interfacing within industrial temperature envelopes. Its specified core voltage range and surface-mount packaging support practical board-level integration and power planning.

This device is well suited for engineering teams designing medium- to high-density FPGA-based systems that prioritize logic density, embedded memory, and I/O flexibility while adhering to RoHS environmental requirements and industrial operating temperatures.

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