EP4CGX50DF27C8N

The EP4CGX50DF27C8N is a Cyclone® IV GX FPGA packaged in a 672-ball BGA (672-FBGA, 27×27) for surface-mount applications. It provides 49,888 logic elements and approximately 2.56 Mbits of embedded RAM with up to 310 general-purpose I/Os, making it suitable for medium- to high-density programmable logic designs.

Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliant, this device operates with a core supply voltage range of 1.16 V to 1.24 V and is supplied in a compact, high-pin-count BGA package.

Key Features

• Logic Capacity  49,888 logic elements to implement combinational and sequential programmable logic functions.
• Embedded Memory  Approximately 2.56 Mbits of on-chip RAM for FIFOs, buffers, and local storage.
• I/O Resources  Up to 310 I/O pins to support extensive interfacing and peripheral connectivity.
• Package & Mounting  672-ball FBGA (27×27) in a surface-mount package for high-density PCB integration.
• Power  Core supply voltage range of 1.16 V to 1.24 V to match system power rails and power budgets.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard embedded and commercial electronics.
• Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Embedded control and logic  Implement complex control algorithms and deterministic logic using the device’s large logic element count and on-chip RAM.
• Interface and I/O bridging  Use the 310 I/Os to connect multiple peripherals, buses, or custom interfaces on compact PCBs.
• Custom digital processing  Build application-specific datapaths and accelerators that leverage the available logic resources and embedded memory.
• Prototyping and integration  A high-pin-count BGA package and substantial resources make this device suitable for development platforms and integration into end products.

Unique Advantages

• High logic density: 49,888 logic elements provide significant room for complex designs without immediate need to scale to larger families.
• Substantial on-chip RAM: Approximately 2.56 Mbits of embedded memory supports local buffering and state storage for data-intensive functions.
• Generous I/O count: 310 I/Os enable wide-ranging peripheral and bus connectivity on a single device.
• Compact, high-pin-count package: The 672-FBGA (27×27) provides extensive routing options while minimizing board footprint.
• Commercial temperature and RoHS compliance: Suitable for standard commercial applications with environmental compliance for manufacturing.

Why Choose EP4CGX50DF27C8N?

The EP4CGX50DF27C8N pairs a significant logic element count with sizeable embedded memory and a high I/O count in a compact 672-BGA package, offering a balanced platform for medium- to high-density programmable logic designs. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of standard embedded and electronics products.

Engineers and procurement teams selecting this part benefit from a device that consolidates logic, memory, and I/O on a single FPGA footprint—helping to reduce component count and simplify board-level integration while maintaining clear, verifiable electrical and thermal limits.

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