EP4CGX50DF27C7

The EP4CGX50DF27C7 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 672‑BGA package. It provides a high count of programmable logic resources and embedded memory with a substantial number of user I/O pins, packaged for surface‑mount assembly and specified for commercial temperature operation.

With 49,888 logic elements, approximately 2.56 Mbits of embedded memory and 310 I/O, this device is targeted at commercial applications that require dense programmable logic, on‑chip RAM and a compact BGA footprint.

Key Features

• Core Logic  49,888 logic elements provide extensive programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 2.56 Mbits of on‑chip RAM supports data buffering, temporary storage and on‑device memory requirements.
• I/O Capacity  310 user I/O pins allow broad interfacing options for peripherals, sensors and external peripherals.
• Package & Mounting  672‑BGA (supplier package: 672‑FBGA, 27×27) in a surface‑mount format for compact board integration.
• Power  Specified supply voltage range of 1.16 V to 1.24 V to match system power rails and design constraints.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic density: 49,888 logic elements enable implementation of substantial digital logic and custom datapaths on a single device.
• Significant on‑chip memory: Approximately 2.56 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage needs.
• Extensive I/O count: 310 I/O pins support multiple interfaces and external device connectivity without immediate need for I/O expanders.
• Compact BGA footprint: 672‑BGA (27×27) package balances high pin count with a compact board area for space‑constrained designs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial product deployments.
• RoHS compliant: Meets standard environmental compliance requirements for lead‑free assembly.

Why Choose EP4CGX50DF27C7?

The EP4CGX50DF27C7 combines a large pool of programmable logic, meaningful on‑chip RAM capacity and a high I/O count in a single, surface‑mount 672‑BGA package. Its commercial temperature rating and RoHS compliance make it appropriate for standard commercial applications that require compact integration of substantial programmable logic and memory resources.

This part is suitable for designers seeking a dense FPGA solution with clear electrical and mechanical specifications—logic element count, embedded memory size, I/O availability, supply voltage range and package information are all defined to support engineering evaluation and BOM decision making.

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