EP4CGX50CF23I7

The EP4CGX50CF23I7 is an Intel Cyclone® IV GX field-programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a combination of high logic capacity, on-chip embedded memory, and a high pin count for designs that require reconfigurable digital logic in industrial environments.

With support for a tight core voltage range and an industrial operating temperature window, this device is suited to applications that demand stable programmable logic, significant I/O connectivity, and compact board-level integration.

Key Features

• Logic Capacity  3,118 configurable logic blocks (CLBs) delivering 49,888 logic elements for complex, user-defined digital designs.
• Embedded Memory  Approximately 2.56 Mbits of on-chip RAM to implement FIFOs, buffers, and local storage without external memory.
• I/O Resources  290 user I/O pins to support multiple interfaces and high pin-count system designs.
• Power  Core voltage supply range from 1.16 V to 1.24 V to match tightly regulated FPGA power domains.
• Package & Mounting  484-ball BGA (supplier package: 484-FBGA, 23 × 23) in a surface-mount format for dense, board-level integration.
• Operating Temperature  Industrial-grade temperature rating from −40 °C to 100 °C for robust operation across a broad thermal range.
• Compliance  RoHS compliant for regulatory and environmental alignment.

Typical Applications

• Industrial Embedded Systems  Reconfigurable logic and on-chip memory enable customized control, data processing, and protocol handling in industrial equipment.
• High-Density I/O Systems  The 290 I/Os support multi-interface designs and signal routing in compact electronic systems.
• Board-Level Integration  The 484-BGA surface-mount package allows designers to implement dense, space-efficient solutions for embedded applications.

Unique Advantages

• High Logic Density: 49,888 logic elements provide headroom for complex finite state machines, custom accelerators, and glue logic.
• Integrated Memory: Approximately 2.56 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Extensive I/O: 290 I/O pins enable flexible interfacing to peripherals, sensors, and external controllers.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Compact, High-Pin Package: 484-FBGA (23 × 23) allows high pin count in a compact footprint for dense system designs.
• Regulatory Compliance: RoHS compliant to meet environmental and manufacturing requirements.

Why Choose EP4CGX50CF23I7?

The EP4CGX50CF23I7 positions itself as a robust, industrial-grade FPGA option that balances high logic capacity, embedded memory, and abundant I/O in a compact BGA package. Its specified core voltage range and industrial temperature rating support stable operation in demanding embedded environments.

This device is a fit for designers building industrial embedded systems, high-density I/O platforms, and compact board-level solutions that benefit from reconfigurable logic and on-chip memory. Its combination of features supports scalable designs while simplifying external component needs and maintaining regulatory compliance.

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