EP4CGX50CF23I7N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA |
|---|---|
| Quantity | 100 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 290 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3118 | Number of Logic Elements/Cells | 49888 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2562048 |
Overview of EP4CGX50CF23I7N – Cyclone IV GX FPGA, 49,888 Logic Elements (484-BGA)
The EP4CGX50CF23I7N is a Cyclone® IV GX field programmable gate array (FPGA) in a 484-BGA package. It delivers 49,888 logic elements and approximately 2.56 Mbits of embedded memory for programmable logic integration.
Designed for industrial applications, this surface-mount FPGA offers 290 user I/O pins, a 1.16 V to 1.24 V core supply range, and an operating temperature range of −40°C to 100°C, enabling deployment in temperature-demanding environments.
Key Features
- Core Logic 49,888 logic elements provide a large programmable fabric for implementing custom logic, state machines, and datapath functions.
- Embedded Memory Approximately 2.56 Mbits of on-chip RAM support buffering, FIFOs, and small lookup tables without external memory.
- I/O Density 290 user I/O pins enable multiple parallel interfaces and flexible board-level connectivity.
- Power Core supply operating range of 1.16 V to 1.24 V for predictable power-domain planning.
- Package & Mounting 484-FBGA (23×23) / 484-BGA surface-mount package supports high-density PCB layouts and modern assembly processes.
- Industrial Temperature Rating Rated for −40°C to 100°C operation to meet the needs of temperature-challenging installations.
- Regulatory Compliance RoHS compliant to support environmentally conscious manufacturing and deployment.
Typical Applications
- Industrial Control Industrial systems that require an extended temperature range and robust I/O can leverage the EP4CGX50CF23I7N for control logic and interface tasks.
- Embedded System Acceleration Designs needing substantial programmable logic and on-chip memory can offload compute kernels and custom datapaths to the FPGA fabric.
- High-density Interface Bridging With 290 I/O pins and a compact 484-FBGA package, the device is suited for applications that consolidate and translate multiple parallel signals on a single board.
Unique Advantages
- High logic capacity: 49,888 logic elements let designers implement sizable combinational and sequential logic blocks without partitioning across multiple devices.
- Significant on-chip RAM: Approximately 2.56 Mbits of embedded memory reduces dependence on external memory for mid-size buffering and temporary storage.
- Robust I/O count: 290 user I/O pins provide flexibility for parallel interfaces, control lines, and sensor or actuator connectivity.
- Industrial-grade operating range: −40°C to 100°C rating supports deployment in harsher environments where commercial-grade parts are unsuitable.
- Compact, high-density package: 484-FBGA (23×23) surface-mount package enables space-efficient board designs while maintaining routing density.
- RoHS compliant: Facilitates environmentally compliant manufacturing and product distribution.
Why Choose EP4CGX50CF23I7N?
The EP4CGX50CF23I7N delivers a balance of sizable programmable logic, embedded memory, and a high I/O count in a compact 484-FBGA package tailored for industrial environments. Its operating temperature range and surface-mount package make it a practical choice for engineers building robust, space-constrained systems that require on-board programmable logic.
This FPGA is suited for designers who need scalable logic capacity and embedded memory on a single device, combined with the supply and temperature characteristics required for long-term deployment in industrial settings.
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