EP4CGX50CF23C8N

The EP4CGX50CF23C8N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, offered in a 484-BGA package. It combines mid-range logic capacity with on-chip RAM and a high I/O count to support a wide range of digital designs.

With 49,888 logic elements, approximately 2.56 Mbits of embedded memory and 290 I/Os, this device is suited to projects that require substantial logic integration, embedded memory and flexible I/O in a compact surface-mount package.

Key Features

• Core Logic — 49,888 logic elements provide capacity for moderate to complex logic implementations and custom digital functions.
• Embedded Memory — Approximately 2.56 Mbits of on-chip RAM for data buffering, state storage and memory-intensive logic tasks.
• I/O Resources — 290 I/O pins to support extensive peripheral interfacing and board-level connectivity.
• Package — 484-ball FBGA (23×23) in a 484-BGA footprint; designed for surface-mount assembly.
• Power — Core supply range of 1.16 V to 1.24 V for compatibility with specified power delivery designs.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.

Typical Applications

• Embedded Systems — Implement custom logic, protocol handling and system control functions using integrated logic and memory resources.
• High-Density I/O Interfaces — Aggregate and manage multiple parallel or serial interfaces with the device’s large I/O count.
• Prototyping and Development — Evaluate FPGA-based designs that require mid-range logic and on-chip memory in a compact package.

Unique Advantages

• Significant Logic Capacity: 49,888 logic elements enable implementation of sizeable custom logic blocks without external logic expansion.
• On-Chip Memory: Approximately 2.56 Mbits of embedded RAM reduces dependency on external memory for many common buffering and storage tasks.
• Extensive I/O: 290 I/Os allow flexible connectivity for sensors, peripherals and parallel interfaces, simplifying board routing options.
• Compact, Surface-Mount Package: 484-FBGA (23×23) packaging supports dense PCB layouts and standard SMT assembly processes.
• Tightly Defined Power Window: Core voltage range of 1.16 V to 1.24 V supports direct specification in power delivery design.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation for mainstream commercial applications.

Why Choose EP4CGX50CF23C8N?

The EP4CGX50CF23C8N positions itself as a practical choice for designs needing substantial logic resources, embedded memory and a high I/O count in a compact BGA package. Its defined core voltage range and commercial temperature rating make it suitable for production systems and board designs targeting standard commercial environments.

Engineers and procurement teams can rely on the device’s combination of logic density, on-chip RAM and I/O capability when selecting components for mid-range FPGA implementations where integration and board-level density are priorities.

Request a quote or submit an inquiry to begin procurement or to discuss how EP4CGX50CF23C8N can meet your design requirements.