EP4CGX50CF23C6N

The EP4CGX50CF23C6N is an Intel Cyclone® IV GX Field Programmable Gate Array (FPGA) delivered in a 484-BGA package. It provides a high-density programmable logic fabric together with embedded memory and a large number of I/O pins, suited for commercial electronic designs requiring configurable logic and on-chip memory.

Key characteristics provided for system integration include 49,888 logic elements, approximately 2.56 Mbits of embedded memory, 290 I/Os, a 484-FBGA (23 × 23) package, single-supply operation in the 1.16 V–1.24 V range, and commercial-grade operating temperature support from 0 °C to 85 °C.

Key Features

• Logic Resources — 49,888 logic elements to implement custom digital functions, state machines, and combinational/sequential logic.
• Embedded Memory — Approximately 2.56 Mbits of on-chip RAM for buffering, FIFOs, and small data storage requirements without external memory.
• High I/O Count — 290 general-purpose I/O pins to support multiple interfaces, parallel buses, and mixed-signal front ends.
• Package and Mounting — 484-BGA (supplier package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact board integration and reliable soldered connections.
• Power Supply — Core supply range of 1.16 V to 1.24 V for system power planning and regulator selection.
• Operating Grade — Commercial temperature range rated from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliance — Lead-free, RoHS-compliant device for regulatory and environmental requirements.

Unique Advantages

• Substantial Logic Capacity: 49,888 logic elements enable complex logic integration on a single device, reducing the need for multiple discrete CPLDs or PLDs.
• Integrated On-Chip Memory: Approximately 2.56 Mbits of embedded RAM provides on-die storage for data buffering and local state, simplifying board-level memory design.
• Ample I/O Resources: 290 I/Os support diverse peripheral connections and parallel interfaces, increasing design flexibility without external expander chips.
• Compact BGA Footprint: 484-FBGA (23 × 23) package offers a high pin count in a compact form factor for space-constrained PCBs.
• Low-Voltage Core: Narrow core supply window (1.16 V–1.24 V) aids in predictable power sequencing and efficient regulator selection.
• Regulatory Readiness: RoHS compliance supports environmental and manufacturing requirements in commercial production.

Why Choose EP4CGX50CF23C6N?

The EP4CGX50CF23C6N positions itself as a versatile, commercial-grade FPGA option for designers who need significant on-chip logic and memory combined with a large number of I/Os in a compact BGA package. Its specification set supports integration of custom digital functions and local data buffering while meeting RoHS requirements.

This device is well suited for engineering teams aiming to consolidate functionality, reduce external component count, and implement configurable logic solutions with clear power and temperature parameters. Its combination of logic density, embedded RAM, and I/O capacity provides long-term value for scalable, commercially deployed designs backed by the Cyclone® IV GX family heritage.

Request a quote or submit a quotation request for pricing and availability of EP4CGX50CF23C6N to begin procurement and integration planning.