EP4CGX30CF23C8N

The EP4CGX30CF23C8N is a Cyclone® IV GX FPGA from Intel designed for commercial-grade electronic designs requiring mid-range logic capacity, substantial embedded memory, and extensive I/O. Its on-chip resources and compact 484-FBGA (23×23) package make it suitable for commercial embedded systems where board space and integration are key considerations.

Key Features

• Logic Capacity  Provides 29,440 logic elements for implementing custom logic, state machines, and moderate-density digital designs.
• Embedded Memory  Includes 1,105,920 bits of on-chip RAM (approximately 1.106 Mbits) to support buffers, FIFOs, and small on-chip data storage needs.
• I/O Count  290 user I/O pins enable interfacing to multiple peripherals, buses, and external devices without immediate need for external GPIO expanders.
• Power Supply  Core voltage range specified at 1.16 V to 1.24 V to match low-voltage system requirements and simplify power-plane design.
• Package and Mounting  Surface-mount 484-FBGA (23×23) package (484-BGA) provides a compact, board-friendly form factor for high-density assemblies.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C suitable for standard commercial applications.
• Regulatory Compliance  RoHS compliant, supporting regulatory and environmental objectives in commercial product builds.

Typical Applications

• Commercial Embedded Systems  Used to implement custom logic, glue logic, and peripheral control in compact commercial devices.
• Communications Equipment  Provides flexible I/O and on-chip memory for medium-density protocol implementation and interface bridging.
• Video and Image Processing  Supports data buffering and parallel logic suitable for mid-range video pipeline tasks and preprocessing.
• Prototyping and Development  Offers designers a commercial-grade FPGA platform for proof-of-concept, evaluation, and early product development.

Unique Advantages

• Balanced Logic and Memory  29,440 logic elements paired with approximately 1.106 Mbits of embedded RAM provide a practical mix for moderate-complexity designs.
• High I/O Count  290 I/O pins minimize the need for external multiplexing and enable integration of multiple interfaces on a single device.
• Compact BGA Package  The 484-FBGA (23×23) surface-mount package delivers a space-efficient solution for high-density PCB layouts.
• Low-Voltage Core  Specified 1.16–1.24 V supply range aligns with modern low-voltage power rails, aiding power design and system integration.
• Commercial Temperature Rating  Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS Compliant  Meets RoHS requirements to assist with regulatory and environmental compliance in manufactured products.

Why Choose EP4CGX30CF23C8N?

The EP4CGX30CF23C8N Cyclone IV GX FPGA from Intel delivers a practical combination of logic density, embedded memory, and extensive I/O in a compact 484-FBGA package for commercial designs. Its specified core voltage range and commercial temperature rating make it a viable option for product developers seeking a mid-range FPGA platform for embedded systems, communications interfaces, video processing, and general-purpose digital logic implementations.

Engineers and procurement teams will find this device well suited to designs that require a balance of integration and board-level density while aligning with RoHS environmental requirements. The device is positioned for commercial product development and prototyping where a reliable, mid-capacity FPGA is needed.

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