EP4CGX30CF23C6N

The EP4CGX30CF23C6N is a Cyclone® IV GX field-programmable gate array (FPGA) in a 484-ball BGA package designed for commercial applications. It provides reconfigurable logic, embedded RAM, and abundant I/O capacity in a compact surface-mount footprint.

Key on-chip resources include approximately 29,440 logic elements, roughly 1.11 Mbits of embedded memory, and 290 user I/Os, with a core supply range of 1.16 V to 1.24 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 29,440 logic elements provide mid-range programmable logic capacity for complex sequencing, custom datapaths, and control functions.
• Embedded Memory  Approximately 1.11 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support data-heavy processing within the FPGA fabric.
• I/O Resources  290 user I/Os enable dense external connectivity for interfaces, sensors, and peripherals while supporting varied board-level routing requirements.
• Package and Mounting  484-BGA (484-FBGA, 23×23) package in a surface-mount form factor for compact board integration and reliable soldered connections.
• Power  Core voltage supply range of 1.16 V to 1.24 V to match system power rails and design constraints.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• RoHS Compliant  Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Embedded Systems  Use the FPGA’s logic capacity and on-chip RAM to implement custom control, data processing, and protocol bridging in commercial embedded products.
• Interface Aggregation  Leverage 290 I/Os to consolidate multiple peripherals and interfaces onto a single programmable device, simplifying board-level routing.
• Signal Processing  Implement buffering and custom datapaths using the available embedded RAM and logic elements for mid-range signal manipulation tasks.

Unique Advantages

• Substantial Logic Capacity: Approximately 29,440 logic elements deliver the resources needed for sizable custom logic implementations without external ASIC development.
• On-Chip Embedded Memory: About 1.11 Mbits of RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• High I/O Count: 290 user I/Os support complex peripheral and sensor interfaces, enabling system consolidation and fewer external components.
• Compact BGA Packaging: The 484-FBGA (23×23) package provides a balance of density and board-space efficiency for compact commercial designs.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial-environment deployment requirements.
• RoHS Compliance: Facilitates use in lead-free manufacturing and aligns with common environmental requirements.

Why Choose EP4CGX30CF23C6N?

The EP4CGX30CF23C6N positions itself as a commercial-grade Cyclone IV GX FPGA offering a balanced combination of logic density, embedded memory, and high I/O count in a compact 484-BGA surface-mount package. Its electrical and thermal ratings make it suitable for a wide range of commercial electronic designs that require reconfigurable logic and substantial on-chip resources.

Designers seeking a mid-range FPGA solution for embedded processing, interface consolidation, or custom digital logic can leverage this device’s integrated resources to reduce component count and streamline board-level design.

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