EP4CGX30CF19C8N

The EP4CGX30CF19C8N is an Intel Cyclone® IV GX field programmable gate array (FPGA) configured in a 324‑ball BGA package. It combines a substantial logic resource set with on‑chip RAM and a 150-pin I/O capability to support a range of commercial embedded designs.

This device is targeted at designs that require programmable logic alongside embedded memory and flexible I/O, delivered in a surface‑mount 324‑LBGA footprint with a commercial operating temperature range.

Key Features

• Logic Capacity  Contains 29,440 logic elements, providing a sizeable fabric for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 1.11 Mbits of on‑chip RAM (1,105,920 bits) for data buffering, lookup tables, and temporary storage within designs.
• I/O Resources  Up to 150 I/O pins to interface with peripherals, sensors, and external devices in mixed‑signal systems.
• Power  Operates from a core voltage range of 1.16 V to 1.24 V, enabling stable supply domain design and power budgeting.
• Package & Mounting  Supplied in a 324‑LBGA (supplier package: 324‑FBGA 19×19) surface‑mount package that supports compact board designs.
• Temperature & Grade  Commercial grade device specified for operation from 0 °C to 85 °C, suitable for standard commercial applications.
• Compliance  RoHS‑compliant construction to meet common environmental and regulatory requirements.

Typical Applications

• Embedded Systems  Implement custom control logic, protocol handling, or data processing functions that require on‑chip memory and programmable logic.
• Communication Interfaces  Use the device's I/O and logic resources to build or bridge protocol interfaces in commercial communications equipment.
• Prototyping & Development  Rapidly iterate and validate hardware algorithms where reprogrammable logic and substantial embedded RAM are needed.

Unique Advantages

• Ample Logic Resources: 29,440 logic elements enable implementation of complex state machines, datapaths, and custom accelerators without external logic.
• On‑Chip Memory: Approximately 1.11 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Flexible I/O Count: 150 I/Os provide connectivity flexibility for interfacing multiple peripherals and sensors on a single device.
• Compact Surface‑Mount Package: 324‑LBGA (324‑FBGA 19×19) supports space‑constrained PCB layouts while maintaining strong electrical performance.
• Commercial Temperature Rating: Specified 0 °C to 85 °C range aligns with standard commercial applications and environments.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs and procurement requirements.

Why Choose EP4CGX30CF19C8N?

The EP4CGX30CF19C8N positions itself as a commercially rated Cyclone IV GX FPGA offering a balance of logic capacity, embedded memory, and I/O density in a compact 324‑LBGA package. It is well suited to engineering teams building commercial embedded systems, communication interfaces, and hardware prototypes that require reprogrammable logic and on‑chip RAM.

With clear electrical and environmental specifications—including a defined core voltage range and RoHS compliance—this device supports predictable integration into mainstream commercial designs and straightforward supply‑chain planning.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4CGX30CF19C8N for your next design.