EP4CGX30CF23C6

The EP4CGX30CF23C6 is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in a 484-BGA package. It delivers 29,440 logic elements and approximately 1.1 Mbits of embedded memory, with up to 290 general-purpose I/Os for medium-density digital designs.

Designed for commercial-grade applications, the device is a surface-mount 484-FBGA (23×23) package, operates from a 1.16 V to 1.24 V core supply range, and is RoHS compliant.

Key Features

• Logic Capacity  29,440 logic elements provide the programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 1.1 Mbits of on-chip RAM supports buffering, lookup tables, and small data storage requirements within the FPGA fabric.
• I/O Count  Up to 290 I/O pins enable broad connectivity to peripherals, sensors, and external logic within a single device.
• Package & Mounting  Available in a 484-BGA supplier package (484-FBGA, 23×23) and intended for surface-mount assembly.
• Power  Core supply range of 1.16 V to 1.24 V gives a defined operating window for power management and system planning.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content in finished assemblies.

Typical Applications

• Custom Logic and Prototyping  Use the programmable fabric and 29,440 logic elements to implement bespoke digital functions, accelerators, and prototype systems.
• Embedded Systems  Approximately 1.1 Mbits of embedded memory and extensive I/O enable control, interfacing, and buffering tasks in commercial embedded products.
• Communication Interfaces  Up to 290 I/Os support multi-channel peripheral interfacing, protocol bridging, and front-end logic for communication modules.
• Sensor and Peripheral Aggregation  Combine multiple sensor inputs and peripheral signals into a single programmable device for streamlined system integration.

Unique Advantages

• Balanced Logic and Memory:  29,440 logic elements paired with approximately 1.1 Mbits of embedded RAM support mid-range designs that require both logic density and on-chip storage.
• High I/O Count:  290 I/Os reduce the need for external multiplexers or I/O expanders when interfacing multiple signals or peripherals.
• Compact BGA Package:  The 484-FBGA (23×23) package delivers high pin count in a compact surface-mount footprint suited for space-constrained PCBs.
• Defined Power Envelope:  A clear core supply range (1.16 V–1.24 V) simplifies power-supply selection and board-level power planning.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation, aligning with a wide range of commercial electronic products.
• Regulatory Compliance:  RoHS compliance supports environmental and regulatory requirements for commercial assemblies.

Why Choose EP4CGX30CF23C6?

EP4CGX30CF23C6 positions itself as a mid-density Cyclone IV GX FPGA option for designs that require a balance of programmable logic, on-chip memory, and extensive I/O in a compact BGA package. Its commercial-grade temperature range, defined core voltage window, and RoHS compliance make it suitable for mainstream embedded and communication products.

This device is appropriate for engineering teams building custom digital logic, protocol bridges, or multi-peripheral controllers who need predictable on-chip resources and a high I/O count without stepping up to higher-density families.

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