EP4CGX30CF19I7N

The EP4CGX30CF19I7N is a Cyclone® IV GX field programmable gate array (FPGA) in a 324-LBGA package optimized for designs requiring significant on-chip logic and memory. It combines 29,440 logic elements with approximately 1.11 Mbits of embedded RAM and 150 user I/O pins to support complex digital functions and system integration.

Packaged for surface-mount assembly and rated for industrial operation from -40°C to 100°C, this device targets applications that need robust thermal range, a dense I/O footprint, and a compact 324-FBGA (19×19) form factor.

Key Features

• Logic Capacity — 29,440 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory — Approximately 1.11 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic.
• I/O Density — 150 dedicated I/O pins to support multiple parallel interfaces and board-level connections.
• Power Supply — Operates from a core voltage range of 1.16 V to 1.24 V, enabling defined power planning for the FPGA core.
• Package & Mounting — 324-LBGA (supplier package listed as 324-FBGA 19×19) in a surface-mount format for compact PCB integration.
• Industrial Temperature Rating — Rated for operation from -40°C to 100°C, suitable for temperature-sensitive environments.
• RoHS Compliant — Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High-density logic implementations — Use the device’s 29,440 logic elements to implement complex custom digital functions and protocol processing.
• Memory-buffered processing — Leverage approximately 1.11 Mbits of embedded RAM for data buffering, packet handling, or lookup tables.
• Multi-interface systems — 150 I/Os support bridging and glue logic between multiple subsystems or peripherals.
• Industrial control and monitoring — Industrial-grade temperature range (-40°C to 100°C) supports deployment in factory automation and control equipment.

Unique Advantages

• Substantial logic resources: 29,440 logic elements provide capacity for sizeable custom logic designs without immediate need to move to larger devices.
• On-chip memory: Approximately 1.11 Mbits of embedded RAM reduces external memory requirements and lowers bill of materials for buffer- and state-heavy designs.
• High I/O count: 150 I/Os enable flexible interfacing to sensors, peripherals, and other system components, simplifying board-level routing and partitioning.
• Industrial temperature tolerance: Specified -40°C to 100°C operation helps ensure reliable behavior across harsh thermal environments.
• Compact BGA package: 324-LBGA / 324-FBGA (19×19) delivers a dense solution footprint for space-constrained PCBs while supporting surface-mount assembly.
• RoHS compliance: Aligned with environmental requirements for reduced hazardous substances.

Why Choose EP4CGX30CF19I7N?

The EP4CGX30CF19I7N positions itself as a balanced solution for designers who need substantial on-chip logic and embedded memory within a compact, industrial-rated package. Its combination of 29,440 logic elements, approximately 1.11 Mbits of RAM, and 150 I/Os supports integration of complex digital functions and multiple interfaces while maintaining a defined power and thermal envelope.

This device is well suited for development teams and procurement looking for a programmable device that offers integration, predictable supply-chain packaging (324-LBGA / 324-FBGA 19×19), and an extended operating temperature range for robust deployment over the product lifecycle.

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