EP4CGX30CF19C7N

The EP4CGX30CF19C7N is a Cyclone® IV GX FPGA in a 324-ball LFBGA package designed for commercial-grade, surface-mount applications. It combines a substantial logic fabric with embedded RAM and a broad set of I/O to support custom digital logic, control, and interface functions.

With 29,440 logic elements, approximately 1.1 Mbits of on-chip RAM and 150 user I/Os, this device is suited for designs that require mid-range programmable logic capacity, flexible I/O connectivity, and standard commercial temperature operation.

Key Features

• Core Logic  29,440 logic elements provide a mid-range programmable logic resource suitable for complex glue logic, control algorithms, and custom datapaths.
• Embedded Memory  Approximately 1.1 Mbits of on-chip RAM supports buffering, FIFOs, and small on-chip data storage for low-latency designs.
• I/O Capacity  150 user I/O pins enable multiple parallel interfaces and signal routing options for mixed-signal front ends and digital peripherals.
• Power Supply Range  Specified core voltage supply from 1.16 V to 1.24 V, allowing precise power planning and supply sequencing in system designs.
• Package & Mounting  324-LBGA (supplier package: 324-FBGA, 19×19) in a surface-mount form factor to support compact PCB layouts and high-density assembly.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory Compliance  RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• Embedded Logic and Control  Implement custom control state machines, protocol handlers, and glue logic where programmable hardware determinism is required.
• Interface Bridging  Use the device’s 150 I/Os to connect and translate between multiple parallel and serial interfaces in a compact package.
• Signal Processing Acceleration  Deploy on-chip logic and memory to offload deterministic data-path tasks and reduce latency in mixed-signal systems.

Unique Advantages

• Substantial Logic Capacity:  29,440 logic elements enable implementation of complex finite-state machines and moderate-density datapaths without external logic.
• Embedded Memory Integration:  Approximately 1.1 Mbits of on-chip RAM reduces dependence on external memory for buffering and small data storage, simplifying BOM and layout.
• Flexible I/O Count:  150 I/Os accommodate multiple peripherals and interfaces, minimizing the need for additional interface chips.
• Compact Surface-Mount Package:  324-LBGA (19×19 FBGA footprint) supports high-density PCB designs while maintaining thermal and mechanical stability for commercial assemblies.
• Commercial Temperature Suitability:  Rated 0 °C to 85 °C to meet standard commercial product lifecycle requirements.
• RoHS Compliant:  Supports lead-free manufacturing processes and regulatory requirements for many global markets.

Why Choose EP4CGX30CF19C7N?

The EP4CGX30CF19C7N positions itself as a versatile Cyclone® IV GX FPGA option for designers who need a balance of logic density, embedded memory, and I/O flexibility in a commercial-grade, surface-mount package. Its combination of 29,440 logic elements, approximately 1.1 Mbits of on-chip RAM, and 150 I/Os makes it suitable for mid-range programmable logic tasks where integration and compact packaging matter.

This device is well suited to engineers and product teams looking to reduce external component count and simplify PCB routing while maintaining predictable operation across standard commercial temperature ranges. Its RoHS compliance and common FBGA footprint support manufacturability and long-term production planning.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CGX30CF19C7N and to discuss how it can fit into your next design.