EP4CGX30CF19C8

The EP4CGX30CF19C8 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, offering a balance of logic capacity and embedded memory for programmable digital designs. It provides 29,440 logic elements and approximately 1.1 Mbits of on-chip RAM in a compact 324-LBGA package.

Engineered for commercial-grade applications, this surface-mount device includes 150 user I/Os, operates from a core supply of 1.16 V to 1.24 V, and supports an ambient operating range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic  29,440 logic elements and 1,840 logic blocks provide programmable resources for custom digital implementations and complex combinational/sequential logic.
• Embedded Memory  Approximately 1.1 Mbits of on-chip RAM supports buffering, FIFO, and state storage without external memory in many designs.
• I/O and Package  150 user I/O pins in a 324-LBGA (324-FBGA, 19×19) package enable dense external interfacing while minimizing board area.
• Power  Core supply range of 1.16 V to 1.24 V allows integration with low-voltage power rails.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation, suitable for standard temperature environments.
• Mounting & Compliance  Surface-mount BGA package and RoHS compliance simplify assembly and regulatory requirements.

Typical Applications

• Custom digital logic and prototyping  Use the FPGA’s logic capacity for implementing bespoke state machines, accelerators, and validation prototypes.
• Memory-intensive on-chip buffering  Approximately 1.1 Mbits of embedded RAM supports packet buffering, FIFOs, and local data storage for streaming applications.
• I/O-intensive protocol bridging  150 user I/Os enable interface aggregation and protocol conversion between multiple peripherals or sub-systems.
• Compact board-level integration  The 324-LBGA surface-mount package allows a high-density solution where board space is constrained.

Unique Advantages

• High logic density: 29,440 logic elements deliver substantial programmable resources for mid- to high-density designs.
• Substantial embedded memory: Approximately 1.1 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state storage needs.
• Wide I/O count: 150 user I/Os provide flexibility to connect multiple interfaces and peripherals without external I/O expanders.
• Compact BGA footprint: 324-LBGA (19×19) package enables compact system layouts and efficient PCB routing.
• Low-voltage core compatibility: 1.16–1.24 V supply range supports integration with modern low-voltage power domains.
• RoHS compliant, commercial grade: Meets RoHS requirements and is intended for standard commercial operating environments (0 °C to 85 °C).

Why Choose EP4CGX30CF19C8?

The EP4CGX30CF19C8 combines substantial logic capacity, meaningful on-chip memory, and a generous I/O complement in a compact surface-mount BGA package. This balance makes it well suited for engineers building programmable digital systems that require integrated memory and dense external connectivity within a commercial temperature range.

Designed as part of Intel’s Cyclone® IV GX family, the device offers a practical platform for mid-density FPGA designs where board space, on-chip RAM and I/O flexibility are key considerations. It provides a clear upgrade path for designs that need increased integration without moving to specialized grades.

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