EP4CGX30CF19C6

IC FPGA 150 I/O 324FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 1105920 29440 324-LBGA

Quantity 574 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O150Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1840Number of Logic Elements/Cells29440
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1105920

Overview of EP4CGX30CF19C6 – Cyclone® IV GX Field Programmable Gate Array (FPGA), 29,440 logic elements

The EP4CGX30CF19C6 is a Cyclone® IV GX FPGA in a 324‑LBGA package, offering 29,440 logic elements and approximately 1.10592 Mbits of embedded memory. With 150 I/O pins, a surface‑mount 324‑FBGA (19×19) package, and a commercial operating range, it is intended for designs that require mid‑range logic capacity and on‑device memory for buffering and state storage.

Designed for commercial applications, this device operates from a core supply of 1.16 V to 1.24 V and is RoHS compliant, providing a compact, integrated solution for custom digital implementations.

Key Features

  • Core Logic 29,440 logic elements to implement combinational and sequential digital functions with mid‑range integration.
  • Embedded Memory Approximately 1.10592 Mbits of on‑chip RAM for local buffering, lookup tables, and state storage.
  • I/O 150 user I/Os to support a variety of external interfaces and peripheral connections.
  • Package & Mounting 324‑LBGA, supplied in a 324‑FBGA (19×19) surface‑mount package for high pin density in a compact footprint.
  • Power Core voltage range of 1.16 V to 1.24 V to support controlled power budgeting in system designs.
  • Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant for adherence to common environmental standards.

Typical Applications

  • Embedded systems and prototyping — Use the device’s logic capacity and embedded memory to implement custom control and processing functions during development and deployment.
  • I/O‑centric interface modules — 150 I/Os provide flexibility for sensor aggregation, peripheral interfacing, and custom protocol glue logic.
  • Data buffering and custom datapaths — On‑chip RAM supports local buffering, small FIFOs, and state machines for packet or data‑stream handling.
  • Commercial electronic products — Commercial temperature rating and surface‑mount BGA package are suited to consumer and commercial device integration.

Unique Advantages

  • Significant logic density: 29,440 logic elements enable substantial on‑device integration to reduce external components and simplify board design.
  • Integrated memory resources: Approximately 1.10592 Mbits of embedded RAM allow local data storage and buffering without immediate reliance on external memory.
  • High I/O count: 150 user I/Os reduce the need for additional I/O expanders and enable versatile interface options.
  • Compact BGA package: 324‑FBGA (19×19) surface‑mount construction offers a high pin count in a space‑efficient footprint.
  • Predictable power requirements: Narrow supply range (1.16 V to 1.24 V) helps simplify power‑rail design and budgeting.
  • RoHS compliant: Supports environmental requirements for many product supply chains.

Why Choose EP4CGX30CF19C6?

The EP4CGX30CF19C6 positions itself as a commercially graded Cyclone® IV GX FPGA offering a balance of logic capacity, embedded memory, and I/O flexibility in a compact BGA package. Its specification set—29,440 logic elements, approximately 1.10592 Mbits of on‑chip RAM, 150 I/Os, and a controlled core voltage range—makes it suitable for commercial designs that require integrated digital processing and interface density.

Designers seeking a mid‑range FPGA with sufficient on‑device memory and I/O for custom logic, buffering, and interfacing will find a practical platform in this part. The combination of package density, RoHS compliance, and defined operating limits supports reliable deployment in consumer and commercial product lines.

Request a quote or submit an inquiry for pricing and availability of EP4CGX30CF19C6 to move your design forward.

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