EP4CGX30CF19C6
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 1105920 29440 324-LBGA |
|---|---|
| Quantity | 574 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 150 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1840 | Number of Logic Elements/Cells | 29440 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1105920 |
Overview of EP4CGX30CF19C6 – Cyclone® IV GX Field Programmable Gate Array (FPGA), 29,440 logic elements
The EP4CGX30CF19C6 is a Cyclone® IV GX FPGA in a 324‑LBGA package, offering 29,440 logic elements and approximately 1.10592 Mbits of embedded memory. With 150 I/O pins, a surface‑mount 324‑FBGA (19×19) package, and a commercial operating range, it is intended for designs that require mid‑range logic capacity and on‑device memory for buffering and state storage.
Designed for commercial applications, this device operates from a core supply of 1.16 V to 1.24 V and is RoHS compliant, providing a compact, integrated solution for custom digital implementations.
Key Features
- Core Logic 29,440 logic elements to implement combinational and sequential digital functions with mid‑range integration.
- Embedded Memory Approximately 1.10592 Mbits of on‑chip RAM for local buffering, lookup tables, and state storage.
- I/O 150 user I/Os to support a variety of external interfaces and peripheral connections.
- Package & Mounting 324‑LBGA, supplied in a 324‑FBGA (19×19) surface‑mount package for high pin density in a compact footprint.
- Power Core voltage range of 1.16 V to 1.24 V to support controlled power budgeting in system designs.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for adherence to common environmental standards.
Typical Applications
- Embedded systems and prototyping — Use the device’s logic capacity and embedded memory to implement custom control and processing functions during development and deployment.
- I/O‑centric interface modules — 150 I/Os provide flexibility for sensor aggregation, peripheral interfacing, and custom protocol glue logic.
- Data buffering and custom datapaths — On‑chip RAM supports local buffering, small FIFOs, and state machines for packet or data‑stream handling.
- Commercial electronic products — Commercial temperature rating and surface‑mount BGA package are suited to consumer and commercial device integration.
Unique Advantages
- Significant logic density: 29,440 logic elements enable substantial on‑device integration to reduce external components and simplify board design.
- Integrated memory resources: Approximately 1.10592 Mbits of embedded RAM allow local data storage and buffering without immediate reliance on external memory.
- High I/O count: 150 user I/Os reduce the need for additional I/O expanders and enable versatile interface options.
- Compact BGA package: 324‑FBGA (19×19) surface‑mount construction offers a high pin count in a space‑efficient footprint.
- Predictable power requirements: Narrow supply range (1.16 V to 1.24 V) helps simplify power‑rail design and budgeting.
- RoHS compliant: Supports environmental requirements for many product supply chains.
Why Choose EP4CGX30CF19C6?
The EP4CGX30CF19C6 positions itself as a commercially graded Cyclone® IV GX FPGA offering a balance of logic capacity, embedded memory, and I/O flexibility in a compact BGA package. Its specification set—29,440 logic elements, approximately 1.10592 Mbits of on‑chip RAM, 150 I/Os, and a controlled core voltage range—makes it suitable for commercial designs that require integrated digital processing and interface density.
Designers seeking a mid‑range FPGA with sufficient on‑device memory and I/O for custom logic, buffering, and interfacing will find a practical platform in this part. The combination of package density, RoHS compliance, and defined operating limits supports reliable deployment in consumer and commercial product lines.
Request a quote or submit an inquiry for pricing and availability of EP4CGX30CF19C6 to move your design forward.

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