EP4CGX30BF14C8N

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA

Quantity 858 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case169-LBGANumber of I/O72Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1840Number of Logic Elements/Cells29440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1105920

Overview of EP4CGX30BF14C8N – Cyclone® IV GX FPGA, 72 I/O, 169-LBGA

The EP4CGX30BF14C8N is a Cyclone® IV GX field-programmable gate array (FPGA) optimized for commercial-temperature designs. It provides 29,440 logic elements and approximately 1.1 Mbits of embedded RAM, delivered in a compact 169-ball package.

This device is specified for surface-mount assembly with a supply voltage range of 1.16 V to 1.24 V and an operating temperature range of 0 °C to 85 °C, and it is RoHS compliant.

Key Features

  • Logic Capacity  29,440 logic elements suitable for mid-range programmable logic tasks and custom digital designs.
  • Embedded Memory  Approximately 1.1 Mbits of on-chip RAM for data buffering, FIFOs, and state storage without external memory.
  • I/O Count  72 general-purpose I/O pins to support multiple peripherals and interface signals in a single device.
  • Power Supply  Specified core voltage range of 1.16 V to 1.24 V to match system power-rail requirements.
  • Package and Mounting  169-ball package (169-LBGA listed; supplier device package noted as 169-FBGA, 14×14) designed for surface-mount assembly.
  • Temperature Grade  Commercial operating range of 0 °C to 85 °C for standard commercial applications.
  • Regulatory Compliance  RoHS compliant for regulatory and environmental requirements.

Unique Advantages

  • High logic density: 29,440 logic elements enable complex logic integration without multiple devices.
  • On-chip memory: Approximately 1.1 Mbits of embedded RAM reduces reliance on external memory for buffering and storage.
  • Ample I/O: 72 I/O pins provide flexibility for multi-interface designs and peripheral connections.
  • Compact packaging: 169-ball BGA package offers a small board footprint for space-constrained PCB layouts.
  • Commercial temperature support: Rated 0 °C to 85 °C for deployment in standard commercial environments.
  • RoHS compliant: Meets lead-free and hazardous-substance requirements for many supply chains.

Why Choose EP4CGX30BF14C8N?

The EP4CGX30BF14C8N combines substantial programmable logic capacity with embedded memory and a practical I/O count in a compact surface-mount package. Its supply voltage specification and commercial temperature rating make it appropriate for a wide range of standard commercial electronic designs that require integrated programmable logic and on-chip RAM.

Engineers and procurement teams seeking a RoHS-compliant FPGA with clear, verifiable specifications for logic elements, on-chip memory, I/O count, package, and operating conditions will find the EP4CGX30BF14C8N straightforward to evaluate and integrate into their designs.

Request a quote or submit a purchase inquiry to receive pricing, availability, and ordering information for the EP4CGX30BF14C8N.

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