EP4CGX30BF14C7

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA

Quantity 322 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case169-LBGANumber of I/O72Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1840Number of Logic Elements/Cells29440
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1105920

Overview of EP4CGX30BF14C7 – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 I/O, ~1.1 Mbits RAM, 29,440 Logic Elements, 169-LBGA

The EP4CGX30BF14C7 is a Cyclone® IV GX field programmable gate array (FPGA) in a 169-ball LBGA package intended for commercial applications. It provides a balance of configurable logic, on-chip memory, and I/O capability for embedded designs that require moderate logic density and integrated memory.

Key on-chip resources include 29,440 logic elements, approximately 1.1 Mbits of embedded RAM, and 72 I/O pins, making this device suitable for I/O-driven and memory‑assisted custom logic implementations within the 0 °C to 85 °C commercial temperature range.

Key Features

  • FPGA Core — Cyclone IV GX architecture offering 29,440 logic elements and 1,840 logic blocks to implement custom digital functions and state machines.
  • Embedded Memory — Approximately 1.1 Mbits of on-chip RAM to support buffering, lookup tables, and small data stores without external memory.
  • I/O Resources — 72 general-purpose I/O pins to interface with peripherals, sensors, and buses directly from the device.
  • Package — 169-LBGA (supplier package: 169-FBGA, 14×14) providing a compact, surface-mount form factor for space-constrained PCBs.
  • Power — Core voltage supply range of 1.16 V to 1.24 V to match system power-rail requirements.
  • Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for typical commercial-environment deployments.
  • Mounting — Surface-mount device for standard PCB assembly processes.
  • Compliance — RoHS compliant to support lead-free assembly and environmental requirements.

Typical Applications

  • I/O‑Centric Embedded Systems — Use the 72 I/O pins to implement custom interfaces, protocol bridging, and peripheral control in embedded platforms.
  • Custom Logic and Control — Implement state machines, control logic, and glue logic using the 29,440 logic elements for real-time deterministic behavior.
  • On‑Chip Buffering and Data Handling — Leverage approximately 1.1 Mbits of embedded RAM for frame buffering, FIFO queues, and small data caches without external memory.

Unique Advantages

  • Balanced Integration: Combines a substantial logic element count with embedded RAM and multiple I/Os to reduce external component count and simplify board design.
  • Compact Packaging: 169-LBGA (14×14) package delivers a small footprint for space-constrained applications while preserving signal density.
  • Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial deployment environments and testing requirements.
  • Controlled Core Voltage Range: Defined supply range (1.16 V–1.24 V) helps designers plan power delivery and decoupling for stable FPGA operation.
  • RoHS Compliance: Supports lead-free assembly and environmental regulatory needs for modern electronic products.

Why Choose EP4CGX30BF14C7?

The EP4CGX30BF14C7 delivers a practical combination of logic resources, embedded memory, and I/O capacity in a compact 169-LBGA package, making it a strong choice for commercial embedded designs that require configurable logic and on-chip buffering. Its defined core voltage range and commercial temperature rating simplify integration into standard system designs.

This part is well suited to engineers and procurement teams looking for a Cyclone IV GX FPGA with roughly 29,440 logic elements and approximately 1.1 Mbits of embedded RAM, along with a moderate number of I/Os for interface-focused applications. The package and RoHS compliance support modern PCB assembly and environmental requirements.

Request a quote or contact our sales team to discuss availability, pricing, and how EP4CGX30BF14C7 can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up