EP4CGX22CF19I7

The EP4CGX22CF19I7 is a Cyclone® IV GX field programmable gate array (FPGA) in a 324-ball LFBGA package designed for industrial applications. It combines reconfigurable logic resources, embedded memory, and a focused I/O count to support custom digital functions where controlled power, compact packaging, and operation across an extended temperature range are required.

Key Features

• Programmable Logic Capacity  21,280 logic elements provide a substantial resource pool for implementing custom logic, state machines, and datapath functions.
• Logic Array Density  Designed with a significant number of logic structures to map a wide range of user-defined logic designs.
• On‑Chip Embedded Memory  Approximately 0.77 Mbits of total RAM bits for FIFOs, buffering, and small lookup tables within the fabric.
• I/O Count and Package  150 available I/O pins in a compact 324‑LBGA (supplier package: 324‑FBGA, 19×19) footprint for high-density board integration and signal routing.
• Power Supply Range  Core voltage operation from 1.16 V to 1.24 V to match targeted power rails and system designs.
• Industrial Temperature Grade  Rated to operate from –40 °C to 100 °C, supporting deployment in industrial thermal environments.
• Surface Mount Packaging  Surface-mount 324‑LBGA package enables automated assembly and compact board-level designs.
• RoHS Compliant  Meets RoHS requirements for environmental compliance.

Typical Applications

• Systems requiring reconfigurable logic  Use the FPGA to implement custom state machines, protocol adapters, or hardware accelerators where tailored logic is required.
• I/O‑dense embedded designs  The 150 I/O pins and compact 324‑LBGA package suit embedded systems that need a balance of connectivity and board space efficiency.
• Industrial control environments  Industrial-grade temperature rating and surface-mount packaging make the device suitable for controllers and instrumentation operating across extended temperature ranges.

Unique Advantages

• Substantial logic resources: 21,280 logic elements enable implementation of complex custom digital functions without external ASICs.
• On‑chip memory for data buffering: Approximately 0.77 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• Compact, manufacturable package: 324‑LBGA surface-mount package (324‑FBGA, 19×19) supports automated assembly and dense PCB layouts.
• Industrial temperature capability: –40 °C to 100 °C rating supports deployment in environments with broad thermal requirements.
• Controlled core voltage range: 1.16 V to 1.24 V operation simplifies power-rail planning for systems targeting low-voltage core domains.
• Regulatory readiness: RoHS compliance supports environmental and supply-chain requirements.

Why Choose EP4CGX22CF19I7?

The EP4CGX22CF19I7 delivers a balance of logic capacity, embedded memory, and a practical I/O count within a compact industrial-grade package. It is positioned for designs that require configurable hardware resources, reliable operation across extended temperatures, and a manufacturable surface-mount form factor.

Designers and engineers looking to implement custom digital logic, integrate moderate on-chip buffering, and maintain board-level density will find this device suitable for a range of industrial and embedded applications, while RoHS compliance and a defined core voltage range help simplify system integration and sourcing.

Request a quote or submit an inquiry to obtain pricing and availability for EP4CGX22CF19I7.