EP4CGX22CF19C8N

IC FPGA 150 I/O 324FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA

Quantity 1,139 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O150Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1330Number of Logic Elements/Cells21280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits774144

Overview of EP4CGX22CF19C8N – Cyclone® IV GX FPGA, 324-LBGA

The EP4CGX22CF19C8N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, supplied in a compact 324-LBGA package. It delivers a balanced combination of configurable logic, embedded memory, and I/O capacity for commercial-grade embedded designs.

Designed for surface-mount assembly, this device offers 21,280 logic elements and approximately 0.77 Mbits of on-chip RAM, with a 1.16 V to 1.24 V core supply range and a commercial operating temperature rating of 0 °C to 85 °C.

Key Features

  • Core Logic  21,280 logic elements provide programmable fabric for custom digital functions and hardware acceleration.
  • Embedded Memory  Approximately 0.77 Mbits of on-chip RAM (774,144 total RAM bits) for data buffering, FIFOs, and local storage.
  • I/O Count  150 I/O pins to support multiple peripheral interfaces and board-level connectivity requirements.
  • Power Supply  Core voltage range of 1.16 V to 1.24 V to match platform power domains and design constraints.
  • Package & Mounting  324-LBGA package (supplier device package: 324-FBGA, 19×19) in a surface-mount form factor for high-density PCB layouts.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant material construction.

Unique Advantages

  • Compact, high-density package: The 324-LBGA (324-FBGA, 19×19) footprint helps reduce PCB area while supporting substantial I/O and logic.
  • Balanced logic and memory: 21,280 logic elements paired with ~0.77 Mbits of embedded RAM enables a broad range of mid-range FPGA implementations without external memory in many designs.
  • Flexible interfacing: 150 I/O pins offer the headroom needed for multi-channel connectivity and board-level integration.
  • Commercial suitability: Rated for 0 °C to 85 °C, the device is appropriate for standard commercial electronic products and development platforms.
  • Predictable power domain: A defined core voltage window (1.16 V–1.24 V) simplifies power-supply planning and integration into existing systems.
  • Environmentally compliant: RoHS compliance supports regulatory needs for many global electronics programs.

Why Choose EP4CGX22CF19C8N?

The EP4CGX22CF19C8N positions itself as a practical Cyclone IV GX FPGA option for designers seeking a mid-range programmable device in a compact package. Its combination of 21,280 logic elements, substantial embedded RAM, and 150 I/Os provides the flexibility to implement custom logic, buffering, and moderate interface requirements within a surface-mount 324-LBGA footprint.

This commercial-grade device is suited for teams and projects that need predictable electrical and thermal characteristics (1.16 V–1.24 V core, 0 °C–85 °C operating range) and value RoHS-compliant components for mainstream electronic products.

Request a quote or submit a sales inquiry to receive pricing and availability for the EP4CGX22CF19C8N.

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