EP4CGX22CF19C8N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA |
|---|---|
| Quantity | 1,139 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 150 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1330 | Number of Logic Elements/Cells | 21280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 774144 |
Overview of EP4CGX22CF19C8N – Cyclone® IV GX FPGA, 324-LBGA
The EP4CGX22CF19C8N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, supplied in a compact 324-LBGA package. It delivers a balanced combination of configurable logic, embedded memory, and I/O capacity for commercial-grade embedded designs.
Designed for surface-mount assembly, this device offers 21,280 logic elements and approximately 0.77 Mbits of on-chip RAM, with a 1.16 V to 1.24 V core supply range and a commercial operating temperature rating of 0 °C to 85 °C.
Key Features
- Core Logic 21,280 logic elements provide programmable fabric for custom digital functions and hardware acceleration.
- Embedded Memory Approximately 0.77 Mbits of on-chip RAM (774,144 total RAM bits) for data buffering, FIFOs, and local storage.
- I/O Count 150 I/O pins to support multiple peripheral interfaces and board-level connectivity requirements.
- Power Supply Core voltage range of 1.16 V to 1.24 V to match platform power domains and design constraints.
- Package & Mounting 324-LBGA package (supplier device package: 324-FBGA, 19×19) in a surface-mount form factor for high-density PCB layouts.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS-compliant material construction.
Unique Advantages
- Compact, high-density package: The 324-LBGA (324-FBGA, 19×19) footprint helps reduce PCB area while supporting substantial I/O and logic.
- Balanced logic and memory: 21,280 logic elements paired with ~0.77 Mbits of embedded RAM enables a broad range of mid-range FPGA implementations without external memory in many designs.
- Flexible interfacing: 150 I/O pins offer the headroom needed for multi-channel connectivity and board-level integration.
- Commercial suitability: Rated for 0 °C to 85 °C, the device is appropriate for standard commercial electronic products and development platforms.
- Predictable power domain: A defined core voltage window (1.16 V–1.24 V) simplifies power-supply planning and integration into existing systems.
- Environmentally compliant: RoHS compliance supports regulatory needs for many global electronics programs.
Why Choose EP4CGX22CF19C8N?
The EP4CGX22CF19C8N positions itself as a practical Cyclone IV GX FPGA option for designers seeking a mid-range programmable device in a compact package. Its combination of 21,280 logic elements, substantial embedded RAM, and 150 I/Os provides the flexibility to implement custom logic, buffering, and moderate interface requirements within a surface-mount 324-LBGA footprint.
This commercial-grade device is suited for teams and projects that need predictable electrical and thermal characteristics (1.16 V–1.24 V core, 0 °C–85 °C operating range) and value RoHS-compliant components for mainstream electronic products.
Request a quote or submit a sales inquiry to receive pricing and availability for the EP4CGX22CF19C8N.

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