EP4CGX22CF19C6N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA |
|---|---|
| Quantity | 452 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 150 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1330 | Number of Logic Elements/Cells | 21280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 774144 |
Overview of EP4CGX22CF19C6N – Cyclone® IV GX FPGA, 150 I/Os, 21,280 Logic Elements
The EP4CGX22CF19C6N is a Cyclone® IV GX field-programmable gate array (FPGA) from Intel, offered in a 324-ball BGA package. It provides 21,280 logic elements and approximately 0.77 Mbits of embedded memory, delivering a balance of programmable logic capacity and on-chip RAM suitable for commercial designs.
With 150 I/Os, a surface-mount 324-LBGA / 324-FBGA (19×19) package, and a supply voltage window of 1.16 V to 1.24 V, this device is targeted at commercial applications that require flexible logic integration within defined thermal and power envelopes. The device is RoHS compliant and rated for 0 °C to 85 °C operation.
Key Features
- Core Logic 21,280 logic elements for implementing custom digital logic, state machines, and glue logic within a single FPGA device.
- Embedded Memory Approximately 0.77 Mbits of on-chip RAM to support buffering, small FIFOs, and distributed storage for embedded designs.
- I/O Count & Package 150 I/Os provided in a 324-LBGA package (supplier package: 324-FBGA, 19×19) for compact, high-density board integration.
- Power Supply Range Operates from 1.16 V to 1.24 V core supply, enabling predictable power planning and regulator selection.
- Mounting & Grade Surface-mount device offered in commercial grade, designed for standard commercial electronics environments.
- Operating Temperature Specified for operation from 0 °C to 85 °C, aligning with commercial temperature-range requirements.
- Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assembly.
Typical Applications
- Commercial embedded systems — Integrate custom control logic and moderate on-chip memory for application-specific processing in commercial equipment.
- Interface consolidation — Use the device’s I/O density to combine multiple peripheral interfaces and implement protocol bridging within a compact package.
- Prototyping and development — Deploy as a programmable platform for proof-of-concept designs and early-stage hardware validation where commercial-grade components are acceptable.
Unique Advantages
- Balanced logic and memory — 21,280 logic elements combined with approximately 0.77 Mbits of embedded RAM provide a practical mix for many mid-range programmable tasks.
- High I/O density in a compact package — 150 I/Os in a 324-ball BGA footprint enable dense board-level integration without a large package footprint.
- Predictable power planning — A narrow core supply range (1.16 V–1.24 V) simplifies regulator selection and power-sequencing considerations.
- Commercial design fit — Commercial grade and 0 °C–85 °C operating range match mainstream electronics and embedded applications.
- Regulatory readiness — RoHS compliance supports lead-free manufacturing and environmental procurement requirements.
Why Choose EP4CGX22CF19C6N?
The EP4CGX22CF19C6N positions itself as a practical Cyclone IV GX FPGA choice for commercial designs that need a reliable combination of programmable logic, embedded memory, and a moderate I/O count in a compact BGA package. It is suited for engineers seeking a commercially graded FPGA with clear electrical and thermal boundaries.
By combining 21,280 logic elements, approximately 0.77 Mbits of on-chip RAM, and 150 I/Os in a 324-ball BGA, this part offers a straightforward option for consolidating functions, implementing custom logic, and accelerating system development while maintaining RoHS compliance and defined supply/temperature requirements.
Request a quote or submit an inquiry to receive pricing and availability for EP4CGX22CF19C6N. Our team can provide lead-time information and support your component selection for commercial FPGA designs.

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