EP4CGX22CF19C6N

IC FPGA 150 I/O 324FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA

Quantity 452 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O150Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1330Number of Logic Elements/Cells21280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits774144

Overview of EP4CGX22CF19C6N – Cyclone® IV GX FPGA, 150 I/Os, 21,280 Logic Elements

The EP4CGX22CF19C6N is a Cyclone® IV GX field-programmable gate array (FPGA) from Intel, offered in a 324-ball BGA package. It provides 21,280 logic elements and approximately 0.77 Mbits of embedded memory, delivering a balance of programmable logic capacity and on-chip RAM suitable for commercial designs.

With 150 I/Os, a surface-mount 324-LBGA / 324-FBGA (19×19) package, and a supply voltage window of 1.16 V to 1.24 V, this device is targeted at commercial applications that require flexible logic integration within defined thermal and power envelopes. The device is RoHS compliant and rated for 0 °C to 85 °C operation.

Key Features

  • Core Logic 21,280 logic elements for implementing custom digital logic, state machines, and glue logic within a single FPGA device.
  • Embedded Memory Approximately 0.77 Mbits of on-chip RAM to support buffering, small FIFOs, and distributed storage for embedded designs.
  • I/O Count & Package 150 I/Os provided in a 324-LBGA package (supplier package: 324-FBGA, 19×19) for compact, high-density board integration.
  • Power Supply Range Operates from 1.16 V to 1.24 V core supply, enabling predictable power planning and regulator selection.
  • Mounting & Grade Surface-mount device offered in commercial grade, designed for standard commercial electronics environments.
  • Operating Temperature Specified for operation from 0 °C to 85 °C, aligning with commercial temperature-range requirements.
  • Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

  • Commercial embedded systems — Integrate custom control logic and moderate on-chip memory for application-specific processing in commercial equipment.
  • Interface consolidation — Use the device’s I/O density to combine multiple peripheral interfaces and implement protocol bridging within a compact package.
  • Prototyping and development — Deploy as a programmable platform for proof-of-concept designs and early-stage hardware validation where commercial-grade components are acceptable.

Unique Advantages

  • Balanced logic and memory — 21,280 logic elements combined with approximately 0.77 Mbits of embedded RAM provide a practical mix for many mid-range programmable tasks.
  • High I/O density in a compact package — 150 I/Os in a 324-ball BGA footprint enable dense board-level integration without a large package footprint.
  • Predictable power planning — A narrow core supply range (1.16 V–1.24 V) simplifies regulator selection and power-sequencing considerations.
  • Commercial design fit — Commercial grade and 0 °C–85 °C operating range match mainstream electronics and embedded applications.
  • Regulatory readiness — RoHS compliance supports lead-free manufacturing and environmental procurement requirements.

Why Choose EP4CGX22CF19C6N?

The EP4CGX22CF19C6N positions itself as a practical Cyclone IV GX FPGA choice for commercial designs that need a reliable combination of programmable logic, embedded memory, and a moderate I/O count in a compact BGA package. It is suited for engineers seeking a commercially graded FPGA with clear electrical and thermal boundaries.

By combining 21,280 logic elements, approximately 0.77 Mbits of on-chip RAM, and 150 I/Os in a 324-ball BGA, this part offers a straightforward option for consolidating functions, implementing custom logic, and accelerating system development while maintaining RoHS compliance and defined supply/temperature requirements.

Request a quote or submit an inquiry to receive pricing and availability for EP4CGX22CF19C6N. Our team can provide lead-time information and support your component selection for commercial FPGA designs.

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