EP4CGX22BF14C8N

The EP4CGX22BF14C8N is a Cyclone® IV GX FPGA from Intel, provided in a 169-pin BGA package for surface-mount applications. It offers a balance of logic capacity, on-chip memory, and I/O count suitable for commercial-grade electronic designs operating within 0 °C to 85 °C and a core supply range of 1.16 V to 1.24 V.

Key Features

• Logic Capacity 21,280 logic elements capable of implementing complex custom digital functions.
• Embedded Memory Approximately 0.774 Mbits of on-chip RAM (774,144 total RAM bits) for buffering, state storage, and small data structures.
• I/O Count 72 user I/O pins to support multiple peripheral and bus connections on a single device.
• Package and Mounting 169-LBGA package (supplier device package: 169-FBGA, 14×14) designed for surface-mount PCB assembly to optimize board area.
• Power Core supply operating range from 1.16 V to 1.24 V to match system power budgeting requirements.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction.

Unique Advantages

• Balanced logic and memory Delivers 21,280 logic elements alongside roughly 0.774 Mbits of embedded RAM to support mixed logic and data buffering needs on-chip.
• Generous I/O 72 I/O pins provide flexibility for interfacing with peripherals, buses, and external devices without immediate expansion.
• Space-efficient BGA package The 169-LBGA (169-FBGA, 14×14) surface-mount footprint helps conserve PCB area while supporting standard assembly processes.
• Predictable power envelope A defined core voltage range (1.16 V–1.24 V) simplifies power-supply design and component selection.
• Commercial temperature suitability Rated for 0 °C to 85 °C operation, aligning with typical commercial electronics deployment scenarios.
• Regulatory readiness RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4CGX22BF14C8N?

The EP4CGX22BF14C8N positions itself as a practical FPGA choice for commercial electronic designs that require a moderate-to-high logic element count, on-chip memory, and a solid I/O complement in a compact BGA package. Its specified voltage range, temperature rating, and RoHS compliance make it straightforward to integrate into systems with defined power and environmental constraints.

Manufactured by Intel, this Cyclone® IV GX device is suitable for engineers and procurement teams looking for a commercially graded FPGA with clearly stated electrical, packaging, and memory characteristics to support predictable design and BOM planning.

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