EP4CGX22BF14C8
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA |
|---|---|
| Quantity | 133 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LBGA | Number of I/O | 72 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1330 | Number of Logic Elements/Cells | 21280 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 774144 |
Overview of EP4CGX22BF14C8 – Cyclone IV GX FPGA IC, 72 I/O, 169-LBGA
The EP4CGX22BF14C8 is a Cyclone® IV GX field programmable gate array (FPGA) IC from Intel. It provides a programmable fabric with 21,280 logic elements and approximately 0.77 Mbits of embedded memory, intended for commercial-grade digital designs.
This surface-mount FPGA in a 169-LBGA (169-FBGA, 14×14) package offers 72 user I/O pins, a low-voltage core supply range of 1.16 V to 1.24 V, and an operating temperature range of 0 °C to 85 °C, making it suitable for a variety of commercial embedded applications requiring programmable logic and on-chip memory.
Key Features
- Programmable Core — 21,280 logic elements provide the capacity to implement complex custom digital logic and control functions.
- Embedded Memory — Approximately 0.77 Mbits of on-chip RAM to support data buffering, FIFOs, and small lookup tables without external memory.
- I/O — 72 user I/O pins available for interfacing with peripherals, sensors, and board-level signals.
- Package & Mounting — 169-LBGA (supplier package: 169-FBGA, 14×14) package designed for surface-mount assembly to support compact PCB layouts.
- Power — Core supply voltage range of 1.16 V to 1.24 V for the device core domain.
- Operating Range — Commercial temperature grade with an operating temperature range from 0 °C to 85 °C.
- Compliance — RoHS compliant for restriction of hazardous substances.
Typical Applications
- Commercial Embedded Systems — Implement custom control logic, protocol bridging, and board-level processing in commercial electronic products within the specified temperature range.
- Digital Prototyping — Use the programmable fabric and on-chip memory for hardware validation and iterative design of digital functions.
- Interface and Glue Logic — Provide flexible I/O mapping and logic to integrate disparate peripherals and subsystems on a single board.
Unique Advantages
- Substantial Logic Capacity: 21,280 logic elements allow implementation of significant custom logic without immediate need for larger devices.
- Integrated On-Chip Memory: Approximately 0.77 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
- Compact Package: 169-LBGA (14×14) surface-mount package supports high-density board designs while providing 72 I/O pins.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet commercial product requirements.
- Low-Voltage Core: Narrow core voltage range (1.16 V to 1.24 V) enables predictable power-domain design for the device core.
- RoHS Compliant: Meets RoHS requirements for reduced hazardous substance content in assemblies.
Why Choose EP4CGX22BF14C8?
The EP4CGX22BF14C8 positions itself as a commercially rated, mid-density Cyclone IV GX FPGA with a balance of programmable logic, embedded memory, and I/O in a compact 169-LBGA package. Its specification set—21,280 logic elements, roughly 0.77 Mbits of on-chip RAM, 72 I/O pins, and RoHS compliance—makes it suitable for designers seeking a programmable solution for commercial embedded designs and board-level integration.
This device is appropriate for teams that require predictable power-domain design (1.16 V–1.24 V core) and commercial temperature operation. The combination of logic capacity, on-chip memory, and compact packaging supports scalable prototyping and deployment with a well-defined set of electrical and thermal characteristics.
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