EP4CGX22BF14I7

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA

Quantity 644 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / CaseTrayNumber of I/O72Voltage1.16 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs1330Number of Logic Elements/Cells21280
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits774144

Overview of EP4CGX22BF14I7 – Cyclone® IV GX FPGA, 72 I/O, 21,280 logic elements

The EP4CGX22BF14I7 is a Cyclone® IV GX field-programmable gate array (FPGA) from Intel, providing programmable logic in a compact 169-ball FBGA package. Designed for industrial-grade applications, it combines a mid-range logic capacity with on-chip embedded memory and a defined operating temperature range for deployment in industrial and embedded systems.

Key Features

  • Core Architecture Cyclone® IV GX field-programmable gate array architecture in a single device.
  • Logic Capacity 21,280 logic elements (LEs) to implement custom digital logic and control functions.
  • Embedded Memory Approximately 0.77 Mbits of on-chip RAM (774,144 bits) for buffering, FIFOs, and local data storage.
  • I/O Count 72 user I/O pins to interface with peripherals, sensors, and external logic.
  • Power Single supply voltage of 1.16 V simplifies power rail design and sequencing.
  • Thermal and Mechanical Industrial operating temperature range of −40 °C to 100 °C and surface-mount 169-FBGA (14×14) package for board-level integration.
  • Packaging and Handling Supplied in tray format for automated placement and manufacturing workflows.

Typical Applications

  • Industrial Control Implement custom control logic, I/O aggregation, and deterministic interfacing in industrial automation equipment using the device's industrial temperature rating.
  • Embedded Systems Integrate configurable logic and local memory to support embedded processing tasks, protocol bridging, and custom peripheral handling.
  • Interface and I/O Expansion Use the 72 I/O pins to add programmable interface logic between sensors, actuators, and host processors.

Unique Advantages

  • Balanced Logic and Memory: 21,280 logic elements with approximately 0.77 Mbits of embedded RAM provide a balanced resource set for moderate-complexity designs.
  • Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
  • Compact BGA Package: 169-FBGA (14×14) packaging enables high-density board designs while maintaining a manageable footprint.
  • Single Supply Simplicity: A defined 1.16 V supply point can simplify power-system design and sequencing for the FPGA core.
  • Surface-Mount, Tray Delivery: Surface-mount mounting and tray packaging align with automated assembly and high-volume manufacturing processes.

Why Choose EP4CGX22BF14I7?

The EP4CGX22BF14I7 delivers a compact, industrial-grade Cyclone® IV GX FPGA offering a practical mix of logic capacity, embedded memory, and I/O capability in a 169-FBGA package. It is well suited to designs that require configurable digital logic and reliable operation across a wide temperature range.

Engineers and procurement teams looking for a mid-range FPGA from Intel's Cyclone® IV GX family will find this device appropriate for industrial and embedded applications where integration, predictable supply requirements, and package density are important considerations.

Request a quote or submit an inquiry to sales to receive pricing, availability, and lead-time information for EP4CGX22BF14I7.

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