EP4CGX22BF14I7
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA |
|---|---|
| Quantity | 644 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 72 | Voltage | 1.16 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1330 | Number of Logic Elements/Cells | 21280 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 774144 |
Overview of EP4CGX22BF14I7 – Cyclone® IV GX FPGA, 72 I/O, 21,280 logic elements
The EP4CGX22BF14I7 is a Cyclone® IV GX field-programmable gate array (FPGA) from Intel, providing programmable logic in a compact 169-ball FBGA package. Designed for industrial-grade applications, it combines a mid-range logic capacity with on-chip embedded memory and a defined operating temperature range for deployment in industrial and embedded systems.
Key Features
- Core Architecture Cyclone® IV GX field-programmable gate array architecture in a single device.
- Logic Capacity 21,280 logic elements (LEs) to implement custom digital logic and control functions.
- Embedded Memory Approximately 0.77 Mbits of on-chip RAM (774,144 bits) for buffering, FIFOs, and local data storage.
- I/O Count 72 user I/O pins to interface with peripherals, sensors, and external logic.
- Power Single supply voltage of 1.16 V simplifies power rail design and sequencing.
- Thermal and Mechanical Industrial operating temperature range of −40 °C to 100 °C and surface-mount 169-FBGA (14×14) package for board-level integration.
- Packaging and Handling Supplied in tray format for automated placement and manufacturing workflows.
Typical Applications
- Industrial Control Implement custom control logic, I/O aggregation, and deterministic interfacing in industrial automation equipment using the device's industrial temperature rating.
- Embedded Systems Integrate configurable logic and local memory to support embedded processing tasks, protocol bridging, and custom peripheral handling.
- Interface and I/O Expansion Use the 72 I/O pins to add programmable interface logic between sensors, actuators, and host processors.
Unique Advantages
- Balanced Logic and Memory: 21,280 logic elements with approximately 0.77 Mbits of embedded RAM provide a balanced resource set for moderate-complexity designs.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Compact BGA Package: 169-FBGA (14×14) packaging enables high-density board designs while maintaining a manageable footprint.
- Single Supply Simplicity: A defined 1.16 V supply point can simplify power-system design and sequencing for the FPGA core.
- Surface-Mount, Tray Delivery: Surface-mount mounting and tray packaging align with automated assembly and high-volume manufacturing processes.
Why Choose EP4CGX22BF14I7?
The EP4CGX22BF14I7 delivers a compact, industrial-grade Cyclone® IV GX FPGA offering a practical mix of logic capacity, embedded memory, and I/O capability in a 169-FBGA package. It is well suited to designs that require configurable digital logic and reliable operation across a wide temperature range.
Engineers and procurement teams looking for a mid-range FPGA from Intel's Cyclone® IV GX family will find this device appropriate for industrial and embedded applications where integration, predictable supply requirements, and package density are important considerations.
Request a quote or submit an inquiry to sales to receive pricing, availability, and lead-time information for EP4CGX22BF14I7.

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