EP4CGX22BF14I7N

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA

Quantity 1,322 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case169-LBGANumber of I/O72Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1330Number of Logic Elements/Cells21280
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits774144

Overview of EP4CGX22BF14I7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA

The EP4CGX22BF14I7N is an Intel Cyclone IV GX FPGA offering a mid-range programmable logic solution with 21,280 logic elements and approximately 0.77 Mbits of embedded memory (774,144 bits). It is supplied in a 169-ball L-BGA (14×14) package, intended for surface-mount assembly and industrial applications that require extended temperature operation.

Key platform characteristics include 72 general-purpose I/Os, a core supply voltage window of 1.16 V to 1.24 V, and an operating temperature range of −40 °C to 100 °C, making it suitable for industrial-grade embedded designs.

Key Features

  • Logic Fabric 21,280 logic elements provide substantial programmable logic capacity for custom digital functions and mid-density designs.
  • Logic Array Blocks 1,330 logic array blocks for structured allocation of logic resources across your design.
  • Embedded Memory Approximately 0.77 Mbits of on-chip RAM (774,144 bits) for buffering, state storage, and small data tables.
  • I/O Count 72 I/O pins to interface with peripherals, sensors, and external devices in a variety of system configurations.
  • Power Core supply voltage range from 1.16 V to 1.24 V to match targeted power-rail architectures.
  • Package & Mounting 169-LBGA package (supplier device package: 169-FBGA 14×14) designed for surface-mount PCB assembly and compact board layouts.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C and designated as industrial grade for extended-environment deployments.
  • Regulatory Compliance RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Typical Applications

  • Industrial Control and Automation — The industrial temperature rating and 72 I/Os support field-deployed control systems and I/O-intensive automation interfaces.
  • Embedded Processing and Custom Logic — 21,280 logic elements and embedded RAM enable implementation of custom datapaths, protocol handling, and glue logic for embedded platforms.
  • Communications and I/O Bridging — A flexible I/O count and on-chip resources allow protocol adaptation and intermediate buffering between disparate subsystems.

Unique Advantages

  • Significant Logic Capacity: 21,280 logic elements reduce the need for multi-device solutions, simplifying board design and BOM.
  • On-Chip Memory: Approximately 0.77 Mbits of embedded RAM supports data buffering and small lookup tables without external memory.
  • Industrial Reliability: Industrial-grade temperature range (−40 °C to 100 °C) supports deployment in harsh or temperature-variable environments.
  • Compact Surface-Mount Package: 169-LBGA (14×14) package enables dense PCB layouts while maintaining robust electrical connections for production assembly.
  • Controlled Core Voltage: Narrow core supply window (1.16–1.24 V) facilitates predictable power design and integration with regulated power rails.
  • RoHS Compliant: Conforms to RoHS requirements for environmentally conscious manufacturing processes.

Why Choose EP4CGX22BF14I7N?

The EP4CGX22BF14I7N delivers a balanced combination of programmable logic capacity, embedded memory, and industrial-grade environmental specifications. Its 21,280 logic elements, approximately 0.77 Mbits of on-chip RAM, and 72 I/Os provide the resources needed for mid-density custom logic, protocol handling, and I/O-rich embedded systems.

This device is positioned for designers and procurement teams seeking a surface-mount FPGA in a 169-LBGA package with a defined core voltage range and extended operating temperature. The combination of integration, package density, and RoHS compliance supports longer-term production and deployment across industrial applications.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4CGX22BF14I7N. Our team can provide lead-time details and assist with volume pricing and delivery options.

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