EP4CGX22CF19C8

The EP4CGX22CF19C8 is a Cyclone® IV GX field programmable gate array (FPGA) in a compact 324-LBGA package. It provides a moderate-density programmable fabric with 21,280 logic elements and approximately 0.77 Mbits of embedded memory, targeted for commercial-grade, surface-mount applications.

With 150 user I/Os, a low-voltage core supply range (1.16 V to 1.24 V), and RoHS compliance, this device is suited to designs that require configurable digital logic, on-chip RAM, and a small-footprint BGA package within a 0 °C to 85 °C operating window.

Key Features

• Programmable Logic  21,280 logic elements for implementing custom digital functions, state machines, and combinational/sequential logic.
• Embedded Memory  Approximately 0.77 Mbits of on-chip RAM to store buffers, FIFOs, and lookup tables directly in the FPGA fabric.
• I/O Capacity  150 I/O pins to connect peripherals, buses, and external devices while preserving board routing flexibility.
• Power and Voltage  Core supply operating range from 1.16 V to 1.24 V to match system power rails and support low-voltage designs.
• Package & Mounting  324-LBGA (supplier package 324-FBGA, 19×19) in a surface-mount form factor for compact PCB implementations.
• Commercial Grade & Temperature  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for easier integration into lead-free manufacturing flows.

Typical Applications

• Commercial Embedded Systems  Programmable logic and embedded RAM enable custom control, glue logic, and data buffering functions in commercial electronic products.
• Custom I/O and Interface Bridging  150 I/Os support implementing protocol bridging, parallel/serial interface adaptation, and board-level I/O aggregation.
• Prototyping and Low- to Mid-Volume Designs  Surface-mount 324-LBGA package and commercial temperature rating suit rapid development and production of consumer and industrial-facing electronics.

Unique Advantages

• Configurable Logic Capacity: 21,280 logic elements give designers the flexibility to implement complex digital functions without external ASICs.
• On-Chip Memory: Approximately 0.77 Mbits of embedded RAM reduces the need for external memory for many buffering and lookup tasks, simplifying BOM and board layout.
• Ample I/O Count: 150 I/Os allow for broad peripheral connectivity and flexible signal routing on compact PCBs.
• Compact BGA Packaging: 324-LBGA (19×19) surface-mount package conserves board area while supporting high pin density.
• Lead-Free Manufacturing Ready: RoHS compliance supports compliance with modern assembly and environmental requirements.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for designs targeting commercial environments and typical operating conditions.

Why Choose EP4CGX22CF19C8?

The EP4CGX22CF19C8 balances moderate logic density, embedded memory, and a high I/O count in a compact 324-LBGA package, making it a practical choice for commercial designers who need programmable logic without a large board footprint. Its low-voltage core operation and RoHS compliance align with contemporary power and manufacturing requirements.

This part is well suited to teams building commercial embedded systems, interface bridges, and prototype-to-production solutions that require on-chip RAM, a flexible I/O set, and a surface-mount BGA form factor. The device provides a scalable, reprogrammable platform that helps reduce external component count and simplify board-level integration.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for EP4CGX22CF19C8.