EP4CGX22CF19I7N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA |
|---|---|
| Quantity | 1,430 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 150 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1330 | Number of Logic Elements/Cells | 21280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 774144 |
Overview of EP4CGX22CF19I7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA
The EP4CGX22CF19I7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) designed for industrial embedded designs. It integrates a sizable logic fabric and on-chip memory to support configurable digital systems requiring flexible IO and compact packaging.
With 21,280 logic elements, approximately 0.77 Mbits of embedded memory, and 150 user I/Os in a 324-LBGA package, this device targets applications that require moderate logic density, substantial local RAM, and industrial temperature operation.
Key Features
- Core Logic 21,280 logic elements provide the programmable resources for custom digital logic, state machines, and datapath implementation.
- Embedded Memory Approximately 0.77 Mbits (774,144 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
- I/O and Package 150 general-purpose I/Os delivered in a 324-LBGA supplier package (324-FBGA, 19×19) for dense board-level integration.
- Power Supported core voltage range of 1.16 V to 1.24 V for system power planning and regulator selection.
- Thermal and Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-sensitive deployments.
- Mounting and Compliance Surface-mount device (SMD) in a ball grid array and RoHS-compliant for regulatory and assembly considerations.
Unique Advantages
- High logic capacity: 21,280 logic elements enable implementation of complex finite-state machines and moderate-sized datapaths without external logic.
- On-chip buffering: Approximately 0.77 Mbits of embedded memory reduces dependence on external RAM for temporary data storage and buffering.
- Generous I/O count: 150 I/Os support multiple interfaces and peripherals while keeping routing localized on a single device.
- Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
- Compact BGA footprint: 324-LBGA (324-FBGA, 19×19) package balances board density with thermal capability for space-constrained designs.
- Regulatory readiness: RoHS compliance simplifies integration into assemblies requiring lead-free components.
Why Choose EP4CGX22CF19I7N?
The EP4CGX22CF19I7N combines a substantial logic resource pool, meaningful on-chip memory, and a high I/O count in a compact 324-LBGA package, making it a practical choice for industrial embedded designs that require configurable logic and localized data storage. Its specified core voltage range and industrial temperature rating support stable integration into regulated system power and thermal envelopes.
This FPGA is suited for teams and projects that need a balance of programmable logic capacity, embedded RAM, and robust I/O in a RoHS-compliant, surface-mount package, offering a straightforward building block for scalable, maintainable hardware designs.
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