EP4CGX22CF19I7N

IC FPGA 150 I/O 324FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA

Quantity 1,430 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LBGANumber of I/O150Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1330Number of Logic Elements/Cells21280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits774144

Overview of EP4CGX22CF19I7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA

The EP4CGX22CF19I7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) designed for industrial embedded designs. It integrates a sizable logic fabric and on-chip memory to support configurable digital systems requiring flexible IO and compact packaging.

With 21,280 logic elements, approximately 0.77 Mbits of embedded memory, and 150 user I/Os in a 324-LBGA package, this device targets applications that require moderate logic density, substantial local RAM, and industrial temperature operation.

Key Features

  • Core Logic  21,280 logic elements provide the programmable resources for custom digital logic, state machines, and datapath implementation.
  • Embedded Memory  Approximately 0.77 Mbits (774,144 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O and Package  150 general-purpose I/Os delivered in a 324-LBGA supplier package (324-FBGA, 19×19) for dense board-level integration.
  • Power  Supported core voltage range of 1.16 V to 1.24 V for system power planning and regulator selection.
  • Thermal and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-sensitive deployments.
  • Mounting and Compliance  Surface-mount device (SMD) in a ball grid array and RoHS-compliant for regulatory and assembly considerations.

Unique Advantages

  • High logic capacity: 21,280 logic elements enable implementation of complex finite-state machines and moderate-sized datapaths without external logic.
  • On-chip buffering: Approximately 0.77 Mbits of embedded memory reduces dependence on external RAM for temporary data storage and buffering.
  • Generous I/O count: 150 I/Os support multiple interfaces and peripherals while keeping routing localized on a single device.
  • Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
  • Compact BGA footprint: 324-LBGA (324-FBGA, 19×19) package balances board density with thermal capability for space-constrained designs.
  • Regulatory readiness: RoHS compliance simplifies integration into assemblies requiring lead-free components.

Why Choose EP4CGX22CF19I7N?

The EP4CGX22CF19I7N combines a substantial logic resource pool, meaningful on-chip memory, and a high I/O count in a compact 324-LBGA package, making it a practical choice for industrial embedded designs that require configurable logic and localized data storage. Its specified core voltage range and industrial temperature rating support stable integration into regulated system power and thermal envelopes.

This FPGA is suited for teams and projects that need a balance of programmable logic capacity, embedded RAM, and robust I/O in a RoHS-compliant, surface-mount package, offering a straightforward building block for scalable, maintainable hardware designs.

Request a quote or submit an inquiry to check pricing and availability for EP4CGX22CF19I7N. Provide your requirements to receive tailored lead-time and pricing information.

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