EP4CGX30BF14C7N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA |
|---|---|
| Quantity | 722 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LBGA | Number of I/O | 72 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1840 | Number of Logic Elements/Cells | 29440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1105920 |
Overview of EP4CGX30BF14C7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA
The EP4CGX30BF14C7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in a 169-LBGA surface-mount package. It delivers 29,440 logic elements and approximately 1.106 Mbits of embedded memory, together with 72 general-purpose I/O pins for configurable digital designs.
Designed for commercial-temperature applications, this device operates from a core supply range of 1.16 V to 1.24 V and across an ambient range of 0 °C to 85 °C, providing a compact, low-voltage programmable logic option in a 14 × 14 package footprint.
Key Features
- Core Architecture Cyclone® IV GX FPGA architecture with 29,440 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 1.106 Mbits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
- Programmable I/O 72 I/O pins available for interfacing with sensors, peripherals, and bus signals in a variety of digital configurations.
- Power Core voltage supply specified between 1.16 V and 1.24 V to match system power-rail requirements for the device.
- Package & Mounting 169-LBGA (14 × 14) surface-mount package that provides a compact footprint for board-level integration.
- Operating Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Standards Compliance RoHS compliant, meeting common lead-free and hazardous-substance requirements.
Typical Applications
- Custom Digital Logic Implement glue logic, protocol adaptors, or state machines using the device's 29,440 logic elements and flexible I/O.
- Data Buffering and Small Memory Tasks Use the approximately 1.106 Mbits of embedded RAM for buffering, FIFOs, and on-chip storage to reduce external memory needs.
- Peripheral and Interface Control Leverage 72 I/O pins for sensor interfacing, peripheral aggregation, and board-level system glue in compact designs.
- Prototyping and Low- to Mid-Complexity Systems The combination of logic density, on-chip RAM, and compact LBGA package suits development and deployment of space-conscious designs.
Unique Advantages
- Balanced Logic and Memory Capacity: 29,440 logic elements paired with approximately 1.106 Mbits of on-chip RAM enables a wide range of digital functions without immediate reliance on external memory.
- Compact LBGA Package: 169-LBGA (14 × 14) package provides a small board footprint for space-constrained applications.
- Commercial Temperature Range: Rated for 0 °C to 85 °C, making it suitable for standard commercial environments.
- Low-Voltage Core: Core supply range of 1.16 V to 1.24 V supports integration with low-voltage system rails.
- Surface-Mount Compatibility: Surface-mount design simplifies automated assembly and modern PCB manufacturing processes.
- RoHS Compliant: Meets lead-free and hazardous-substance requirements for regulatory and manufacturing consistency.
Why Choose EP4CGX30BF14C7N?
The EP4CGX30BF14C7N offers a practical balance of logic density, embedded memory, and I/O in a compact 169-LBGA package from Intel's Cyclone® IV GX family. Its specifications make it well suited for designers who need substantial on-chip resources in a small surface-mount package while operating within commercial temperature ranges.
This device is ideal for teams developing custom digital logic, on-chip buffering, and peripheral interfacing where a moderate logic element count, meaningful embedded RAM, and a defined I/O complement are required. As a commercial-grade, RoHS-compliant FPGA, it provides a reliable building block for volume and prototype designs that match its electrical and thermal operating conditions.
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