EP4CGX30BF14C7N

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA

Quantity 722 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case169-LBGANumber of I/O72Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1840Number of Logic Elements/Cells29440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1105920

Overview of EP4CGX30BF14C7N – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA

The EP4CGX30BF14C7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in a 169-LBGA surface-mount package. It delivers 29,440 logic elements and approximately 1.106 Mbits of embedded memory, together with 72 general-purpose I/O pins for configurable digital designs.

Designed for commercial-temperature applications, this device operates from a core supply range of 1.16 V to 1.24 V and across an ambient range of 0 °C to 85 °C, providing a compact, low-voltage programmable logic option in a 14 × 14 package footprint.

Key Features

  • Core Architecture Cyclone® IV GX FPGA architecture with 29,440 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory Approximately 1.106 Mbits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
  • Programmable I/O 72 I/O pins available for interfacing with sensors, peripherals, and bus signals in a variety of digital configurations.
  • Power Core voltage supply specified between 1.16 V and 1.24 V to match system power-rail requirements for the device.
  • Package & Mounting 169-LBGA (14 × 14) surface-mount package that provides a compact footprint for board-level integration.
  • Operating Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Standards Compliance RoHS compliant, meeting common lead-free and hazardous-substance requirements.

Typical Applications

  • Custom Digital Logic Implement glue logic, protocol adaptors, or state machines using the device's 29,440 logic elements and flexible I/O.
  • Data Buffering and Small Memory Tasks Use the approximately 1.106 Mbits of embedded RAM for buffering, FIFOs, and on-chip storage to reduce external memory needs.
  • Peripheral and Interface Control Leverage 72 I/O pins for sensor interfacing, peripheral aggregation, and board-level system glue in compact designs.
  • Prototyping and Low- to Mid-Complexity Systems The combination of logic density, on-chip RAM, and compact LBGA package suits development and deployment of space-conscious designs.

Unique Advantages

  • Balanced Logic and Memory Capacity: 29,440 logic elements paired with approximately 1.106 Mbits of on-chip RAM enables a wide range of digital functions without immediate reliance on external memory.
  • Compact LBGA Package: 169-LBGA (14 × 14) package provides a small board footprint for space-constrained applications.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C, making it suitable for standard commercial environments.
  • Low-Voltage Core: Core supply range of 1.16 V to 1.24 V supports integration with low-voltage system rails.
  • Surface-Mount Compatibility: Surface-mount design simplifies automated assembly and modern PCB manufacturing processes.
  • RoHS Compliant: Meets lead-free and hazardous-substance requirements for regulatory and manufacturing consistency.

Why Choose EP4CGX30BF14C7N?

The EP4CGX30BF14C7N offers a practical balance of logic density, embedded memory, and I/O in a compact 169-LBGA package from Intel's Cyclone® IV GX family. Its specifications make it well suited for designers who need substantial on-chip resources in a small surface-mount package while operating within commercial temperature ranges.

This device is ideal for teams developing custom digital logic, on-chip buffering, and peripheral interfacing where a moderate logic element count, meaningful embedded RAM, and a defined I/O complement are required. As a commercial-grade, RoHS-compliant FPGA, it provides a reliable building block for volume and prototype designs that match its electrical and thermal operating conditions.

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