EP4CGX30BF14I7
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA |
|---|---|
| Quantity | 992 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LBGA | Number of I/O | 72 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1840 | Number of Logic Elements/Cells | 29440 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1105920 |
Overview of EP4CGX30BF14I7 – Cyclone® IV GX FPGA, 72 I/O, 169-LBGA
The EP4CGX30BF14I7 is a Cyclone® IV GX field programmable gate array (FPGA) from Intel designed for industrial-grade embedded logic implementations. It delivers 29,440 logic elements and approximately 1.1 Mbits of embedded memory in a compact 169-LBGA package with 72 user I/O pins.
With a specified operating temperature range of -40 °C to 100 °C and a nominal supply window of 1.16 V to 1.24 V, this surface-mount FPGA is suited to industrial and embedded applications that require substantial logic capacity and on-chip RAM in a small-footprint package.
Key Features
- Core Logic 29,440 logic elements and 1,840 CLBs provide substantial programmable logic resource for custom digital designs.
- Embedded Memory Approximately 1.1 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
- I/O 72 general-purpose I/O pins to interface with peripherals and external logic.
- Power Specified supply voltage range of 1.16 V to 1.24 V to support consistent core operation.
- Package & Mounting 169-LBGA package (supplier package: 169-FBGA, 14×14) with surface-mount mounting for compact board designs.
- Temperature & Grade Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for harsher environments.
- Environmental Compliance RoHS-compliant for regulatory and manufacturing compatibility.
Typical Applications
- Industrial Control Use for custom control logic, I/O aggregation, and protocol handling where industrial temperature range and reliable operation matter.
- Embedded Systems Implement system glue logic, custom accelerators, or peripheral interfaces that benefit from on-chip memory and significant logic capacity.
- Communications & Networking Deploy as a configurable processing element for protocol adaptation, packet buffering, or control-plane logic using available I/O and embedded RAM.
Unique Advantages
- High Logic Capacity: 29,440 logic elements enable integration of complex digital functions into a single FPGA.
- Substantial On-Chip RAM: Approximately 1.1 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
- Industrial Temperature Rating: Rated from -40 °C to 100 °C to support deployment in demanding environments.
- Compact, Surface-Mount Package: 169-LBGA (14×14) allows high-density PCB implementations while keeping board footprint small.
- Controlled Core Supply Range: 1.16 V to 1.24 V specification provides clear power requirements for system design.
- RoHS Compliant: Facilitates compliance with environmental regulations and manufacturing processes.
Why Choose EP4CGX30BF14I7?
The EP4CGX30BF14I7 positions itself as an industrial-grade Cyclone® IV GX FPGA offering a balance of sizable logic resources, embedded memory, and a compact BGA package. It is well suited for engineers who require significant programmable logic and on-chip RAM in designs that must operate across an extended temperature range.
This device is appropriate for embedded and industrial designs that demand integration of custom digital functions, interface consolidation, and localized data storage while maintaining a small PCB footprint and surface-mount assembly.
Request a quote or submit a pricing inquiry to get availability and lead-time information for EP4CGX30BF14I7.

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