EP4CGX30BF14C8

IC FPGA 72 I/O 169FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA

Quantity 1,596 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-FBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / CaseTrayNumber of I/O72Voltage1.16 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs1840Number of Logic Elements/Cells29440
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1105920

Overview of EP4CGX30BF14C8 – Cyclone® IV GX FPGA, 29,440 logic elements, approximately 1.11 Mbits embedded memory, 72 I/Os

The EP4CGX30BF14C8 is a Cyclone® IV GX field programmable gate array (FPGA) IC in a 169-pin FBGA package designed for commercial applications. It provides 29,440 logic elements and approximately 1.11 Mbits of on-chip RAM in a surface-mount 169-FBGA (14×14) package.

This device targets designs that require mid-range logic capacity, embedded memory, and a defined set of I/O pins within a commercial temperature range (0 °C to 85 °C) and a fixed supply voltage of 1.16 V.

Key Features

  • Core Logic  29,440 logic elements provide programmable resources for implementing custom digital logic and datapaths.
  • Embedded Memory  Approximately 1.11 Mbits of on-chip RAM (1,105,920 bits) for buffering, FIFOs, and storage close to logic.
  • I/O Count  72 general-purpose I/Os to interface with external devices and peripherals.
  • Power Supply  Single specified supply of 1.16 V for core operation.
  • Package & Mounting  Surface-mount 169-FBGA (14×14) package supplied in tray format for board-level assembly.
  • Operating Range  Commercial grade device rated for 0 °C to 85 °C operation.

Typical Applications

  • Embedded Systems  Use when on-chip logic and embedded RAM are required to implement custom control, signal processing, or glue-logic within commercial products.
  • Interface and Protocol Bridging  Suitable for designs that need a moderate number of I/Os and programmable logic to implement protocol translation or custom interfaces.
  • Prototyping and Development  Fits development projects that require a Cyclone IV GX FPGA with defined logic and memory resources in a compact FBGA package.

Unique Advantages

  • Balanced Logic-to-Memory Ratio: The combination of 29,440 logic elements and ~1.11 Mbits of embedded RAM supports a wide range of mid-density designs without external memory for many use cases.
  • Defined I/O Capacity: 72 I/Os provide predictable interfacing capability for peripherals and external devices.
  • Compact FBGA Packaging: The 169-FBGA (14×14) package enables high-density board layouts while remaining surface-mount compatible.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C, aligning the device with commercial application requirements.
  • Simplified Power Requirement: A single specified core supply of 1.16 V reduces power-rail complexity in system designs.

Why Choose EP4CGX30BF14C8?

The EP4CGX30BF14C8 provides a practical balance of logic capacity, embedded memory, and I/O count in a compact 169-FBGA footprint for commercial designs. Its fixed supply voltage and commercial temperature rating make it suitable for projects where those specific, verifiable electrical and environmental characteristics are required.

This FPGA is appropriate for customers designing mid-range programmable solutions that need on-chip RAM and a moderate number of I/Os in a surface-mount package, offering predictable resource availability for system integration and prototyping.

Request a quote today to evaluate EP4CGX30BF14C8 for your next design or to obtain pricing and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up