EP4CGX30BF14C8
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA |
|---|---|
| Quantity | 1,596 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 72 | Voltage | 1.16 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1840 | Number of Logic Elements/Cells | 29440 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1105920 |
Overview of EP4CGX30BF14C8 – Cyclone® IV GX FPGA, 29,440 logic elements, approximately 1.11 Mbits embedded memory, 72 I/Os
The EP4CGX30BF14C8 is a Cyclone® IV GX field programmable gate array (FPGA) IC in a 169-pin FBGA package designed for commercial applications. It provides 29,440 logic elements and approximately 1.11 Mbits of on-chip RAM in a surface-mount 169-FBGA (14×14) package.
This device targets designs that require mid-range logic capacity, embedded memory, and a defined set of I/O pins within a commercial temperature range (0 °C to 85 °C) and a fixed supply voltage of 1.16 V.
Key Features
- Core Logic 29,440 logic elements provide programmable resources for implementing custom digital logic and datapaths.
- Embedded Memory Approximately 1.11 Mbits of on-chip RAM (1,105,920 bits) for buffering, FIFOs, and storage close to logic.
- I/O Count 72 general-purpose I/Os to interface with external devices and peripherals.
- Power Supply Single specified supply of 1.16 V for core operation.
- Package & Mounting Surface-mount 169-FBGA (14×14) package supplied in tray format for board-level assembly.
- Operating Range Commercial grade device rated for 0 °C to 85 °C operation.
Typical Applications
- Embedded Systems Use when on-chip logic and embedded RAM are required to implement custom control, signal processing, or glue-logic within commercial products.
- Interface and Protocol Bridging Suitable for designs that need a moderate number of I/Os and programmable logic to implement protocol translation or custom interfaces.
- Prototyping and Development Fits development projects that require a Cyclone IV GX FPGA with defined logic and memory resources in a compact FBGA package.
Unique Advantages
- Balanced Logic-to-Memory Ratio: The combination of 29,440 logic elements and ~1.11 Mbits of embedded RAM supports a wide range of mid-density designs without external memory for many use cases.
- Defined I/O Capacity: 72 I/Os provide predictable interfacing capability for peripherals and external devices.
- Compact FBGA Packaging: The 169-FBGA (14×14) package enables high-density board layouts while remaining surface-mount compatible.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C, aligning the device with commercial application requirements.
- Simplified Power Requirement: A single specified core supply of 1.16 V reduces power-rail complexity in system designs.
Why Choose EP4CGX30BF14C8?
The EP4CGX30BF14C8 provides a practical balance of logic capacity, embedded memory, and I/O count in a compact 169-FBGA footprint for commercial designs. Its fixed supply voltage and commercial temperature rating make it suitable for projects where those specific, verifiable electrical and environmental characteristics are required.
This FPGA is appropriate for customers designing mid-range programmable solutions that need on-chip RAM and a moderate number of I/Os in a surface-mount package, offering predictable resource availability for system integration and prototyping.
Request a quote today to evaluate EP4CGX30BF14C8 for your next design or to obtain pricing and availability information.

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