EP4CGX30BF14I7N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA |
|---|---|
| Quantity | 74 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-FBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LBGA | Number of I/O | 72 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1840 | Number of Logic Elements/Cells | 29440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1105920 |
Overview of EP4CGX30BF14I7N – Cyclone® IV GX FPGA, 72 I/Os, ~1.1 Mbits RAM, 29,440 Logic Elements, 169-LBGA
The EP4CGX30BF14I7N is a Cyclone® IV GX field programmable gate array (FPGA) from Intel, supplied in a 169-LBGA package. It provides a mid-density programmable logic fabric with 29,440 logic elements and approximately 1.1 Mbits of on-chip RAM for embedded memory needs.
Targeted at industrial applications, the device combines a 72-pin I/O capability, a narrow core voltage range (1.16 V to 1.24 V), and an extended operating temperature range (−40 °C to 100 °C), making it suitable for designs that require configurable logic, deterministic I/O counts, and industrial-grade environmental tolerance.
Key Features
- Core FPGA Fabric 29,440 logic elements provide programmable resources for implementing custom digital logic and state machines.
- Embedded Memory Approximately 1.1 Mbits (1,105,920 bits) of on-chip RAM to support FIFOs, buffers, and small on-chip data storage.
- I/O and Package 72 user I/Os in a surface-mount 169-LBGA package (supplier device package: 169-FBGA, 14×14) for compact board-level integration.
- Power Supply Narrow core supply range of 1.16 V to 1.24 V to match board power-rail planning for the device core.
- Industrial Grade & Temperature Industrial-grade qualification with an operating temperature range from −40 °C to 100 °C for deployment in temperature-challenged environments.
- Regulatory Compliance RoHS-compliant to support environmental and manufacturing requirements.
Typical Applications
- Industrial Control Systems Implement custom control logic, I/O aggregation, and sequencing functions while meeting industrial temperature and reliability demands.
- Embedded Processing and Interfaces Provide glue logic, protocol bridging, and peripheral interfacing using on-chip logic and memory.
- Communications and Networking Use the device’s programmable fabric and embedded RAM for packet buffering, framing, and custom data-path functions.
Unique Advantages
- Balanced Logic and Memory: 29,440 logic elements paired with ~1.1 Mbits of embedded RAM enable a mix of compute and storage for mid-range designs.
- Defined I/O Count: 72 I/Os provide predictable interface capacity for system-level I/O planning and connector assignments.
- Industrial Temperature Range: Rated −40 °C to 100 °C to support deployment in industrial and temperature-challenged applications.
- Compact, Surface-Mount Package: 169-LBGA (169-FBGA, 14×14) allows high-density board layouts without sacrificing I/O accessibility.
- Controlled Core Voltage: A narrow 1.16 V to 1.24 V supply range simplifies power-rail design and core decoupling strategies.
- RoHS Compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and supply chains.
Why Choose EP4CGX30BF14I7N?
The EP4CGX30BF14I7N positions itself as a practical Cyclone IV GX FPGA option for engineers who need a mid-density programmable device with a substantial number of logic elements and embedded RAM, a defined I/O count, and industrial operating range. Its package and surface-mount format support compact system designs where board space and standard assembly are considerations.
This device is well suited for teams developing industrial control, embedded interface, or communications modules that require on-chip memory and reconfigurable logic while meeting RoHS and industrial temperature specifications. Selecting this FPGA provides a predictable, manufacturer-specified foundation for scalable, long-lived designs.
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