EP4CGX30CF19C6N
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 1105920 29440 324-LBGA |
|---|---|
| Quantity | 407 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 150 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1840 | Number of Logic Elements/Cells | 29440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1105920 |
Overview of EP4CGX30CF19C6N – Cyclone® IV GX FPGA, 150 I/O, 324-LBGA
The EP4CGX30CF19C6N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel. It integrates 29,440 logic elements and approximately 1.11 Mbits of embedded memory to implement custom digital logic in a compact surface-mount package.
Key device attributes include support for 150 I/O, a supply voltage range of 1.16 V to 1.24 V, and commercial-grade operation from 0 °C to 85 °C, all delivered in a 324-LBGA package (supplier package: 324-FBGA, 19 × 19).
Key Features
- Core / Logic 29,440 logic elements provide the programmable fabric for implementing complex digital functions.
- Embedded Memory Approximately 1.11 Mbits of on-chip RAM for buffering, state storage, and LUT-based memory structures.
- I/O Density 150 general-purpose I/O pins to support multiple external interfaces and device interconnects.
- Power Supported supply voltage range of 1.16 V to 1.24 V to match system power rails and design margins.
- Package & Mounting 324-LBGA package (supplier package: 324-FBGA, 19 × 19) with surface-mount mounting type for board-level integration.
- Operating Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard environmental conditions.
- Environmental Compliance RoHS-compliant construction to support regulatory and manufacturing requirements.
Unique Advantages
- High logic capacity: 29,440 logic elements enable sizable programmable designs without external logic expansion.
- On-chip memory: Approximately 1.11 Mbits of embedded RAM reduces dependency on external memory for many control and buffering tasks.
- Generous I/O count: 150 I/O pins offer flexibility for interfacing multiple peripherals and buses.
- Compact, surface-mount package: 324-LBGA (324-FBGA, 19 × 19) balances board density with thermal and routing considerations.
- Controlled supply range: 1.16 V to 1.24 V operation supports predictable power sequencing and integration into regulated systems.
- RoHS compliant: Meets lead-free and hazardous-substance requirements for modern manufacturing processes.
Why Choose EP4CGX30CF19C6N?
The EP4CGX30CF19C6N combines substantial logic capacity and embedded memory with a broad I/O complement in a commercial-grade 324-LBGA package. Its defined supply-voltage window and RoHS compliance make it suitable for designs that require predictable electrical characteristics and regulatory-aligned manufacturing.
This device is appropriate for projects that need a balance of logic resources, on‑chip memory, and I/O in a compact, surface-mount form factor, backed by Intel's Cyclone IV GX family lineage.
Request a quote or submit an inquiry to get pricing and availability information for the EP4CGX30CF19C6N.

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