EP4CGX30CF19C6N

IC FPGA 150 I/O 324FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 1105920 29440 324-LBGA

Quantity 407 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O150Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1840Number of Logic Elements/Cells29440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1105920

Overview of EP4CGX30CF19C6N – Cyclone® IV GX FPGA, 150 I/O, 324-LBGA

The EP4CGX30CF19C6N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel. It integrates 29,440 logic elements and approximately 1.11 Mbits of embedded memory to implement custom digital logic in a compact surface-mount package.

Key device attributes include support for 150 I/O, a supply voltage range of 1.16 V to 1.24 V, and commercial-grade operation from 0 °C to 85 °C, all delivered in a 324-LBGA package (supplier package: 324-FBGA, 19 × 19).

Key Features

  • Core / Logic  29,440 logic elements provide the programmable fabric for implementing complex digital functions.
  • Embedded Memory  Approximately 1.11 Mbits of on-chip RAM for buffering, state storage, and LUT-based memory structures.
  • I/O Density  150 general-purpose I/O pins to support multiple external interfaces and device interconnects.
  • Power  Supported supply voltage range of 1.16 V to 1.24 V to match system power rails and design margins.
  • Package & Mounting  324-LBGA package (supplier package: 324-FBGA, 19 × 19) with surface-mount mounting type for board-level integration.
  • Operating Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard environmental conditions.
  • Environmental Compliance  RoHS-compliant construction to support regulatory and manufacturing requirements.

Unique Advantages

  • High logic capacity: 29,440 logic elements enable sizable programmable designs without external logic expansion.
  • On-chip memory: Approximately 1.11 Mbits of embedded RAM reduces dependency on external memory for many control and buffering tasks.
  • Generous I/O count: 150 I/O pins offer flexibility for interfacing multiple peripherals and buses.
  • Compact, surface-mount package: 324-LBGA (324-FBGA, 19 × 19) balances board density with thermal and routing considerations.
  • Controlled supply range: 1.16 V to 1.24 V operation supports predictable power sequencing and integration into regulated systems.
  • RoHS compliant: Meets lead-free and hazardous-substance requirements for modern manufacturing processes.

Why Choose EP4CGX30CF19C6N?

The EP4CGX30CF19C6N combines substantial logic capacity and embedded memory with a broad I/O complement in a commercial-grade 324-LBGA package. Its defined supply-voltage window and RoHS compliance make it suitable for designs that require predictable electrical characteristics and regulatory-aligned manufacturing.

This device is appropriate for projects that need a balance of logic resources, on‑chip memory, and I/O in a compact, surface-mount form factor, backed by Intel's Cyclone IV GX family lineage.

Request a quote or submit an inquiry to get pricing and availability information for the EP4CGX30CF19C6N.

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