EP4CGX30CF19C7

The EP4CGX30CF19C7 is a Cyclone® IV GX FPGA from Intel provided in a 324-LBGA package. It combines 29,440 logic elements with approximately 1.1 Mbits of on-chip RAM and 150 general-purpose I/O to support integration of custom digital logic and local memory within a surface-mount BGA footprint.

With a narrow core supply range of 1.16 V to 1.24 V and a commercial operating temperature range of 0 °C to 85 °C, this device is targeted at designs that require moderate logic density, significant embedded memory capacity, and a compact package for board-level integration.

Key Features

• Logic Capacity  Provides 29,440 logic elements to implement custom digital functions, state machines, and glue logic.
• Embedded Memory  Includes approximately 1.1 Mbits of on-chip RAM for local buffering, FIFOs, and small memory structures.
• I/O  Offers 150 I/O pins to support multiple interfaces and parallel connections to peripherals and external devices.
• Package & Mounting  Supplied in a 324-LBGA package (supplier device package: 324-FBGA, 19×19) and designed for surface-mount assembly.
• Power  Core supply voltage range: 1.16 V to 1.24 V to support predictable power budgeting at the FPGA core.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements for restricted substances.

Typical Applications

• Interface Bridging  Use the device’s I/O count and logic capacity to implement protocol translation, bus bridging, and signal aggregation functions.
• Embedded Logic and Control  Ideal for integrating custom control state machines, timing logic, and peripheral controllers with on-chip RAM for local buffering.
• Prototyping and Development  Provides a platform for validating FPGA-based designs that require moderate logic density and compact BGA packaging.

Unique Advantages

• Well-balanced integration: Combining 29,440 logic elements with approximately 1.1 Mbits of RAM and 150 I/O reduces the need for external glue logic and memory in many designs.
• Compact BGA footprint: 324-LBGA (324-FBGA 19×19) packaging enables dense board layouts while supporting surface-mount assembly processes.
• Predictable power planning: A defined core voltage range (1.16 V to 1.24 V) simplifies power-supply design and dimensioning for the FPGA core.
• RoHS compliant: Meets restricted-substances requirements for lead-free manufacturing and global environmental standards.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation, suitable for typical commercial and consumer product environments.

Why Choose EP4CGX30CF19C7?

The EP4CGX30CF19C7 positions itself as a practical FPGA choice when you need a balance of logic capacity, embedded memory, and a generous I/O complement in a compact BGA package. Its combination of 29,440 logic elements and approximately 1.1 Mbits of on-chip RAM supports designs that consolidate digital functions and reduce external component count.

Manufactured by Intel and provided in a surface-mount 324-LBGA package with RoHS compliance and commercial-grade temperature support, this device is suited to development and production environments where integration density, predictable power planning, and board-level assembly compatibility matter.

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