EP4CGX30CF23C7N

The EP4CGX30CF23C7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, provided in a 484-ball FBGA package (23×23). Designed for commercial-grade applications, this device offers a balanced combination of programmable logic capacity, embedded memory, and a high I/O count for complex digital designs.

With a supply voltage range of 1.16 V to 1.24 V and an operating temperature range of 0 °C to 85 °C, the device is intended for surface-mount integration into commercial electronic systems where moderate logic density and I/O connectivity are required.

Key Features

• Logic Capacity Provides 29,440 logic elements to implement custom digital functions and state machines.
• Embedded Memory Approximately 1.1 Mbits of on-chip RAM (1,105,920 bits) for buffering, FIFOs, and local data storage.
• I/O Resources 290 general-purpose I/O pins to support wide peripheral and interface integration.
• Power Operates from a core supply voltage between 1.16 V and 1.24 V, enabling predictable power-domain planning.
• Package & Mounting 484-FBGA (23×23) package in a surface-mount form factor for compact PCB integration.
• Operating Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Compliance RoHS-compliant construction to meet common environmental and regulatory requirements.

Typical Applications

• Commercial Embedded Systems Implement custom digital logic and control functions using the device's 29,440 logic elements and on-chip memory.
• I/O-Intensive Interfaces Use the 290 I/O pins to aggregate and manage multiple peripherals, sensors, and external interfaces on a single IC.
• On-Board Processing and Buffering Leverage approximately 1.1 Mbits of embedded RAM for local data buffering, temporary storage, and simple packet or frame buffering tasks.

Unique Advantages

• High Logic Density: 29,440 logic elements enable substantial custom digital implementation without external ASICs.
• Significant On-Chip Memory: Approximately 1.1 Mbits of embedded RAM reduces the need for external memory in many buffering and local storage scenarios.
• Extensive I/O Count: 290 I/Os provide flexibility for multicore interfacing, sensor arrays, and diverse peripheral connectivity.
• Compact Surface-Mount Package: The 484-FBGA (23×23) package supports dense PCB layouts while maintaining a robust footprint for routing.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• RoHS Compliant: Manufactured to meet RoHS environmental standards for broader regulatory acceptance.

Why Choose EP4CGX30CF23C7N?

The EP4CGX30CF23C7N positions itself as a versatile commercial-grade FPGA that combines a substantial logic element count, meaningful embedded memory, and a high I/O complement in a compact 484-FBGA package. These attributes make it suitable for designers who need programmable logic capacity and flexible interfacing without moving to larger or more complex devices.

Backed by Intel's Cyclone® IV GX family heritage and available documentation, this device offers a clear, verifiable specification set for procurement and design planning, helping teams manage BOM complexity and achieve predictable integration in commercial electronic products.

Request a quote or submit an inquiry to check availability and pricing for the EP4CGX30CF23C7N. Our team can provide lead-time information and assist with technical questions related to integration and deployment.