EP4CGX30CF23I7N

The EP4CGX30CF23I7N is a Cyclone® IV GX field programmable gate array (FPGA) in a 484-BGA surface-mount package, designed for industrial applications. It integrates 29,440 logic elements and approximately 1.11 Mbits of embedded memory, offering a balance of logic density, on-chip RAM, and I/O capacity for mid-range programmable logic designs.

Key Features

• Core Logic 29,440 logic elements provide substantial programmable logic resources for custom digital functions and control logic.
• Embedded Memory Approximately 1.11 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Capacity 290 user I/Os enable extensive peripheral, sensor, and interface connectivity without external expanders.
• Power Operates from a defined core supply voltage range of 1.16 V to 1.24 V for consistent core power delivery.
• Package & Mounting 484-BGA (484-FBGA, 23×23) surface-mount package for compact board integration and reliable soldered connections.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-demanding environments.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Control Use the industrial temperature rating and extensive I/O to implement motor control, PLC logic, and sensor interfacing in factory environments.
• Embedded Systems Leverage the logic capacity and on-chip RAM for custom embedded processing, protocol handling, and glue logic in compact systems.
• Networking & Communications High I/O count and programmable logic support protocol adaptation, packet handling, and interface bridging in communications equipment.
• Test & Measurement Combine dense logic and on-chip memory to implement data acquisition front-ends, real-time preprocessing, and I/O aggregation.

Unique Advantages

• Substantial Logic Density: 29,440 logic elements enable complex state machines, parallel processing blocks, and custom datapaths on a single device.
• On-Chip Memory: Approximately 1.11 Mbits of embedded RAM reduces dependence on external memory for buffering and real-time data handling.
• Generous I/O Resources: 290 I/Os simplify board-level design by minimizing the need for external I/O expanders and enabling multiple simultaneous interfaces.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in harsher operating environments where extended temperature tolerance is required.
• Compact, Surface-Mount Package: 484-BGA (23×23) packaging delivers a space-efficient footprint for high-density PCB layouts.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4CGX30CF23I7N?

The EP4CGX30CF23I7N positions itself as an industrial-grade, mid-range FPGA that combines a significant logic resource pool with on-chip memory and a high I/O count in a compact 484-BGA package. Its defined core voltage range and wide operating temperature make it suitable for designers requiring deterministic power and extended environmental tolerance.

This device is well suited for engineers building industrial control systems, embedded platforms, communication interfaces, and test equipment who need a balanced mix of logic, memory, and connectivity in a surface-mount form factor.

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