EP4CGX30CF23I7

The EP4CGX30CF23I7 is an Intel Cyclone® IV GX field programmable gate array (FPGA) IC designed for industrial-grade embedded designs. It combines a dense logic fabric with on-chip memory and a large complement of I/O in a compact 484-ball BGA package.

With 29,440 logic elements, approximately 1.1 Mbits of embedded memory and 290 I/O pins, this device is suited to applications that require customizable digital logic, flexible interfacing and reliable operation across an industrial temperature range.

Key Features

• Core Logic  Approximately 29,440 logic elements provide programmable logic capacity for custom state machines, datapaths and glue logic.
• Embedded Memory  Approximately 1.1 Mbits of on-chip RAM (1,105,920 bits) for buffering, FIFOs and local storage.
• I/O and Connectivity  290 user I/O pins support extensive external interfacing and parallel/serial connectivity options.
• Power  Operates from a core supply voltage range of 1.16 V to 1.24 V, enabling controlled power delivery for the programmable core.
• Package and Mounting  484-ball FBGA (23 × 23) package in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Standards Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control Systems  Implement custom control logic, timing and I/O handling while meeting industrial temperature requirements.
• Protocol Bridging and Interfaces  Use the device’s abundant I/O and embedded memory to implement protocol conversion, bus bridging and glue logic between subsystems.
• Embedded Signal and Data Processing  Leverage logic capacity and on-chip RAM for deterministic datapath processing, buffering and preprocessing of sensor or communication data.
• Custom Peripheral and Prototype Development  Rapidly realize and iterate hardware functions and peripherals without changing fixed silicon.

Unique Advantages

• Compact, high-density logic: 29,440 logic elements enable substantial custom logic in a single device, reducing system part count.
• On-chip memory for buffering: Approximately 1.1 Mbits of embedded RAM supports local storage and low-latency data handling without external memory.
• High I/O count: 290 I/O pins provide flexibility to connect to multiple peripherals and buses directly.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact BGA package: 484-FBGA (23×23) surface-mount package simplifies board layout while maintaining signal density.
• Regulatory compatibility: RoHS compliance facilitates assembly and regulatory alignment.

Why Choose EP4CGX30CF23I7?

The EP4CGX30CF23I7 delivers a balance of programmable logic density, embedded memory and abundant I/O in a single, industrial-grade FPGA package. Its specifications make it well suited for designers who need flexible hardware implementation, robust I/O capacity and operation across extended temperature ranges.

This device is a practical choice for system designers developing industrial control, interface bridging, embedded processing or rapid prototype solutions that require the configurability of an FPGA combined with the reliability expected in industrial applications.

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