EP4CGX30CF23C8

The EP4CGX30CF23C8 is an Intel Cyclone® IV GX Field Programmable Gate Array supplied in a 484-BGA package. This commercial-grade, surface-mount FPGA delivers a balance of on-chip logic, embedded memory and I/O capacity for programmable digital designs.

Key device characteristics include 29,440 logic elements, approximately 1.11 Mbits of embedded memory, 290 I/Os, a 484-FBGA (23×23) package, a 1.16 V–1.24 V supply range and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture  Intel Cyclone® IV GX family FPGA, providing a programmable fabric for custom digital logic implementation.
• Logic Capacity  29,440 logic elements to implement complex finite-state machines, custom datapaths and control logic.
• Embedded Memory  Approximately 1.11 Mbits of on-chip RAM for buffering, FIFOs and small on-chip data stores.
• I/O Count  290 available I/Os to support broad peripheral and bus interfacing needs on a single device.
• Package & Mounting  484-BGA (supplier package: 484-FBGA 23×23) in a surface-mount form factor for compact, high-density PCB layouts.
• Power Supply  Specified operating supply range of 1.16 V to 1.24 V for core power planning and system integration.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Commercial embedded systems  Use the FPGA’s logic density and on-chip RAM to implement custom control, protocol bridging and data-handling functions in commercial electronic products.
• High-density I/O interfacing  Leverage 290 I/Os and the compact 484-BGA package to consolidate multiple peripheral connections in space-constrained PCBs.
• Custom digital processing  Deploy logic elements and embedded memory for tailored datapaths, moderate buffering and timing-critical functions.

Unique Advantages

• Substantial logic resource: 29,440 logic elements allow designers to realize complex custom logic without external glue logic.
• On-chip memory for buffering: Approximately 1.11 Mbits of embedded RAM reduces reliance on external memory for mid-sized data storage needs.
• High I/O count in a compact package: 290 I/Os in a 484-FBGA (23×23) footprint helps maximize connectivity while minimizing board area.
• Defined power window: A narrow core supply range (1.16 V–1.24 V) simplifies power budgeting and decoupling strategies.
• Commercial-ready specification: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployments.

Why Choose EP4CGX30CF23C8?

The EP4CGX30CF23C8 positions itself as a commercially graded Cyclone IV GX FPGA option for designers who need a balanced combination of logic density, embedded memory and a high I/O count in a compact BGA package. Its specified supply range and RoHS compliance make it practical for mainstream commercial electronic products.

This device is well suited to engineers and teams building programmable logic solutions that require on-chip RAM, substantial logic resources and broad interfacing capability while maintaining a small PCB footprint and standard commercial temperature operation.

Request a quote or submit an inquiry to check pricing and availability for the EP4CGX30CF23C8.