EP4CGX50CF23C6

The EP4CGX50CF23C6 is an Intel Cyclone® IV GX field programmable gate array (FPGA) offered in a 484-FBGA (23×23) surface-mount package. It provides 49,888 logic elements, approximately 2.56 Mbits of embedded memory, and 290 user I/Os, delivering a compact programmable-logic solution for commercial-grade electronic systems.

With a core supply range of 1.16 V to 1.24 V and an operating temperature range of 0 °C to 85 °C, this device is intended for designs that need substantial on-chip logic and memory in a high-density BGA package while meeting RoHS compliance requirements.

Key Features

• Core Architecture – Cyclone IV GX FPGA fabric from Intel, providing a flexible programmable-logic platform for custom digital designs.
• Logic Capacity – 49,888 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory – Approximately 2.56 Mbits (2,562,048 bits) of on-chip RAM for data buffering, state storage, and small look-up tables.
• I/O and Package – 290 available I/O pins in a 484-FBGA (23×23) package (package case: 484-BGA), providing high-density external connectivity in a compact footprint.
• Power – Core voltage supply range of 1.16 V to 1.24 V to match system power-rail constraints and design requirements.
• Operating Range – Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance – Surface-mount package and RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Embedded Systems – Implement control logic, custom peripherals, and state machines where a compact, high-density FPGA is required.
• Communications Equipment – Use the device for protocol bridging, packet buffering and custom data-path logic that benefit from on-chip memory and extensive I/O.
• I/O-Intensive Interfaces – Create interface hubs and signal aggregation solutions leveraging 290 user I/Os in a single package.
• Prototyping and Development – Evaluate and iterate digital designs that demand substantial logic resources and embedded RAM in a production-style BGA package.

Unique Advantages

• High Logic Capacity: 49,888 logic elements enable implementation of sizeable custom logic blocks without external PLDs.
• Significant On-Chip Memory: Approximately 2.56 Mbits of embedded RAM supports buffering, FIFOs, and state storage directly on the FPGA fabric.
• Broad I/O Count: 290 user I/Os provide flexibility for multi-channel interfaces and dense system integration.
• Compact BGA Packaging: 484-FBGA (23×23) offers a high pin-count solution in a space-efficient surface-mount form factor.
• Low-Voltage Core Operation: Core supply range of 1.16 V to 1.24 V facilitates integration with modern low-voltage power domains.
• Regulatory Compatibility: RoHS-compliant construction supports environmental and manufacturing requirements.

Why Choose EP4CGX50CF23C6?

The EP4CGX50CF23C6 positions itself as a commercial-grade FPGA choice for designs that require nearly 50k logic elements, several megabits of embedded memory, and a high I/O count in a compact 484-FBGA package. Its specified voltage range and operating temperature make it suitable for a wide range of mainstream electronics that need programmable logic integration without sacrificing board density.

Backed by Intel's Cyclone IV GX family, the device is appropriate for engineering teams and procurement seeking a high-capacity, RoHS-compliant FPGA solution for applications ranging from embedded control to communications and I/O-centric systems.

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