EP4CGX50CF23C8
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA |
|---|---|
| Quantity | 437 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 290 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3118 | Number of Logic Elements/Cells | 49888 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2562048 |
Overview of EP4CGX50CF23C8 – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA
The EP4CGX50CF23C8 is an Intel Cyclone IV GX field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a programmable logic fabric with 49,888 logic elements, approximately 2.56 Mbits of on-chip RAM, and 290 general-purpose I/O pins in a 23 × 23 484-FBGA footprint.
This device targets commercial-grade applications that require configurable digital logic in a surface-mount 484-BGA package. Key electrical and environmental parameters include a core supply range of 1.16–1.24 V and an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.
Key Features
- Logic Capacity — 49,888 logic elements for implementing configurable digital logic and custom architectures.
- Embedded Memory — Approximately 2.56 Mbits of on-chip RAM to support data buffering, state storage, and lookup tables.
- I/O Count — 290 I/O pins to support multi-interface connectivity and board-level integration.
- Package & Mounting — 484-BGA (484-FBGA, 23×23) surface-mount package suitable for compact PCB layouts.
- Power — Core voltage supply specified between 1.16 V and 1.24 V for system power planning.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Unique Advantages
- Substantial Logic Resources: 49,888 logic elements provide headroom for complex logic implementations and mid-range integration on a single device.
- Integrated On-Chip RAM: Approximately 2.56 Mbits of embedded memory reduces the need for external memory in many designs, simplifying board layout.
- High I/O Count: 290 I/Os enable connectivity to multiple peripherals, interfaces, and board-level signals without external expanders.
- Compact BGA Package: The 484-FBGA (23×23) surface-mount package balances pin density and PCB area for space-constrained designs.
- Predictable Power Envelope: A defined core voltage range (1.16–1.24 V) helps streamline power-supply selection and thermal budgeting.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
Why Choose EP4CGX50CF23C8?
The EP4CGX50CF23C8 combines a sizable logic element count, on-chip memory, and a high I/O count within a compact 484-BGA package, making it well suited for commercial designs that need configurable digital logic and moderate on-chip memory capacity. Its defined supply voltage range and commercial temperature rating provide clear constraints for system-level power and thermal design.
This device is appropriate for designers and teams seeking a commercially graded Cyclone IV GX-class FPGA with substantial logic and memory resources, RoHS compliance, and a compact surface-mount footprint for mid-density programmable logic integration.
Request a quote or submit a purchase inquiry to obtain pricing and availability for EP4CGX50CF23C8.

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