EP4CGX50CF23C8

IC FPGA 290 I/O 484FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA

Quantity 437 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O290Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3118Number of Logic Elements/Cells49888
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2562048

Overview of EP4CGX50CF23C8 – Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA

The EP4CGX50CF23C8 is an Intel Cyclone IV GX field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a programmable logic fabric with 49,888 logic elements, approximately 2.56 Mbits of on-chip RAM, and 290 general-purpose I/O pins in a 23 × 23 484-FBGA footprint.

This device targets commercial-grade applications that require configurable digital logic in a surface-mount 484-BGA package. Key electrical and environmental parameters include a core supply range of 1.16–1.24 V and an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Logic Capacity — 49,888 logic elements for implementing configurable digital logic and custom architectures.
  • Embedded Memory — Approximately 2.56 Mbits of on-chip RAM to support data buffering, state storage, and lookup tables.
  • I/O Count — 290 I/O pins to support multi-interface connectivity and board-level integration.
  • Package & Mounting — 484-BGA (484-FBGA, 23×23) surface-mount package suitable for compact PCB layouts.
  • Power — Core voltage supply specified between 1.16 V and 1.24 V for system power planning.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Unique Advantages

  • Substantial Logic Resources: 49,888 logic elements provide headroom for complex logic implementations and mid-range integration on a single device.
  • Integrated On-Chip RAM: Approximately 2.56 Mbits of embedded memory reduces the need for external memory in many designs, simplifying board layout.
  • High I/O Count: 290 I/Os enable connectivity to multiple peripherals, interfaces, and board-level signals without external expanders.
  • Compact BGA Package: The 484-FBGA (23×23) surface-mount package balances pin density and PCB area for space-constrained designs.
  • Predictable Power Envelope: A defined core voltage range (1.16–1.24 V) helps streamline power-supply selection and thermal budgeting.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.

Why Choose EP4CGX50CF23C8?

The EP4CGX50CF23C8 combines a sizable logic element count, on-chip memory, and a high I/O count within a compact 484-BGA package, making it well suited for commercial designs that need configurable digital logic and moderate on-chip memory capacity. Its defined supply voltage range and commercial temperature rating provide clear constraints for system-level power and thermal design.

This device is appropriate for designers and teams seeking a commercially graded Cyclone IV GX-class FPGA with substantial logic and memory resources, RoHS compliance, and a compact surface-mount footprint for mid-density programmable logic integration.

Request a quote or submit a purchase inquiry to obtain pricing and availability for EP4CGX50CF23C8.

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