EP4CGX50CF23C7

The EP4CGX50CF23C7 is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a reconfigurable logic fabric with a substantial logic element count and embedded memory suitable for commercial embedded designs.

With commercial temperature grading and a surface-mount 484-FBGA (23×23) package, this device targets applications that require significant on-chip logic, memory and I/O capacity within a compact board footprint.

Key Features

• Core Logic Capacity — 49,888 logic elements for implementing complex digital logic and control functions.
• Logic Array Blocks — 3,118 logic array blocks to structure and organize configurable logic resources.
• Embedded Memory — Total on-chip RAM of 2,562,048 bits (approximately 2.56 Mbits) to support buffering, look-up tables and state storage.
• I/O Count — 290 user I/O pins to support extensive interfacing and board-level connectivity.
• Power Supply — Operating core voltage range of 1.16 V to 1.24 V for explicit supply requirements during power design.
• Package & Mounting — 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for dense PCB integration.
• Operating Range & Grade — Commercial grade device rated for 0°C to 85°C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Systems & Control — Use the device’s sizable logic capacity and embedded memory to implement custom control logic and finite-state machines for commercial embedded products.
• Communications and I/O Bridging — High I/O count allows integration of multiple interfaces and protocol bridging on a single FPGA.
• Prototyping and Development — Large logic resource pool supports hardware prototyping and validation of complex digital designs.
• Data Buffering and Signal Processing — Approximately 2.56 Mbits of on-chip RAM provides local storage for data buffering and intermediate processing tasks.

Unique Advantages

• High Logic Density: 49,888 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 2.56 Mbits of on-chip RAM supports buffering and state retention without external memory.
• Extensive I/O: 290 user I/Os provide flexibility for multi-interface designs and complex system integration.
• Compact BGA Package: 484-FBGA (23×23) surface-mount package delivers high density integration for space-constrained boards.
• Commercial Temperature Grade: Rated for 0°C to 85°C operation to meet standard commercial product requirements.
• RoHS Compliant: Environmentally compliant manufacturing and disposal alignment.

Why Choose EP4CGX50CF23C7?

The EP4CGX50CF23C7 positions itself as a high-capacity, commercially graded Cyclone IV GX FPGA suited for designs that require significant on-chip logic, embedded memory and a large number of I/Os in a compact BGA footprint. Its defined voltage supply range and commercial operating temperature make it appropriate for mainstream embedded applications and board-level integration.

This device is a practical choice for engineers looking to centralize multiple digital functions, reduce external component count, and leverage a compact 484-BGA package while maintaining clear, verifiable device specifications.

Request a quote or submit an inquiry to obtain pricing and availability for EP4CGX50CF23C7 and to discuss how this FPGA can fit your design requirements.