EP4CGX50CF23C7N

The EP4CGX50CF23C7N is a Cyclone® IV GX field programmable gate array (FPGA) IC designed for commercial applications requiring programmable logic and moderate on-chip memory. It integrates a large logic fabric and a substantial embedded memory footprint in a compact 484-FBGA package.

With 49,888 logic elements, approximately 2.56 Mbits of embedded memory and 290 I/O pins, this device is targeted at commercial embedded systems and general-purpose FPGA implementations that need a balance of logic density, I/O capability, and a compact surface-mount package.

Key Features

• Logic Capacity — 49,888 logic elements organized across 3,118 configurable logic blocks, providing significant programmable resources for complex logic designs.
• Embedded Memory — Approximately 2.56 Mbits of on-chip RAM to support buffering, FIFOs, and small-scale data storage without external memory.
• I/O and Integration — 290 I/O pins to support a wide range of peripheral interfaces and board-level interconnections.
• Package and Mounting — 484-FBGA (23×23) package, surface-mount compatible, enabling dense PCB placement and reliable solder connections.
• Power — Nominal core voltage supply range of 1.16 V to 1.24 V to match targeted power-rail designs.
• Commercial Grade and Temperature — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory Compliance — RoHS compliant, supporting standard environmental and assembly requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and protocol bridging using the device’s large logic capacity and on-chip memory.
• High-Density I/O Control — Manage multiple peripheral interfaces and board-level signals with up to 290 I/O pins.
• Prototyping and System Integration — Rapidly develop and iterate designs that require significant programmable logic and embedded RAM in a compact package.

Unique Advantages

• High Logic Density: 49,888 logic elements enable complex finite-state machines, custom datapaths, and control logic without offloading functions to external devices.
• Substantial On-Chip Memory: Approximately 2.56 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage.
• Generous I/O Count: 290 I/Os provide flexibility for multiple interfaces, sensor connections, and board-level signals.
• Compact BGA Footprint: 484-FBGA (23×23) package keeps board area low while supporting robust surface-mount assembly.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• RoHS Compliant: Environmentally compliant for modern assembly and regulatory requirements.

Why Choose EP4CGX50CF23C7N?

The EP4CGX50CF23C7N delivers a balanced combination of logic capacity, embedded memory, and I/O count in a compact 484-FBGA surface-mount package, making it well-suited for commercial embedded designs that require significant programmable resources. Its core voltage range and commercial operating temperature align with standard board-level power and thermal designs.

This device is appropriate for engineers designing mid- to high-density programmable logic solutions who need on-chip RAM and a high I/O count in a RoHS-compliant, commercial-grade FPGA package.

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